A calibrated model assures that the model will reflect actual process behavior and can display realistic 3D visualizations of complex process flows.
The semiconductor industry has always faced challenges caused by device scaling, architecture evolution, and process complexity and integration. These challenges are coupled with a need to provide new technology to the market quickly. In the initial stages of semiconductor technology development, innovative process flow schemes must be tested using silicon test wafers. These wafer tests are lengthy and costly.
As an alternative, process engineers, and integrators can use virtual process modeling to test alternative process schemes and architectures without relying on wafer-based testing. However, it can be challenging to build a virtual process model that can accurately replicate an actual process flow. One important aspect of building an accurate process model is to ensure that the model is calibrated. Having a calibrated model is important, since it provides assurance to the process integrators and engineers that the model will reflect actual process behavior. A calibrated model can also display realistic 3D visualizations of complex process flows and provide accurate results during process window studies and design technology co-optimization.
Click here to read more.
Academia, industry partnerships ramp to entice undergrads into hardware engineering.
Pitches continue to decrease, but new tooling and technologies are required.
Buried features and re-entrant geometries drive application-specific metrology solutions.
Issues involving design, manufacturing, packaging, and observability all need to be solved before this approach goes mainstream for many applications.
Etching tools are becoming more application-specific, with each new node requiring higher selectivity.
While terms often are used interchangeably, they are very different technologies with different challenges.
Technology and business issues mean it won’t replace EUV, but photonics, biotech and other markets provide plenty of room for growth.
Commercial chiplet marketplaces are still on the distant horizon, but companies are getting an early start with more limited partnerships.
Existing tools can be used for RISC-V, but they may not be the most effective or efficient. What else is needed?
How customization, complexity, and geopolitical tensions are upending the global status quo.
The industry is gaining ground in understanding how aging affects reliability, but more variables make it harder to fix.
Key pivot and innovation points in semiconductor manufacturing.
Tools become more specific for Si/SiGe stacks, 3D NAND, and bonded wafer pairs.
Leave a Reply