How to achieve higher density, lower power, tighter cost margins and shorter time to market.
Given the complexity of today’s chips, packages, and PCBs, designing each in isolation is no longer judicious. Cross-domain co-design and co-analysis are key to ensuring optimal performance, cost reduction, and faster time to market. Such capabilities are provided by the Cadence Virtuoso System Design Platform, which integrates IC design—including multiple heterogeneous die—into the Allegro and Sigrity packaging and PCB design domains. This technology provides a seamless and automated design ow between IC, package, and PCB design that can accelerate the overall design process and minimize errors.
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