SiC Power Electronics Packaging: Floating Die Structure and Liquid Metal Fluidic Connection (Cambridge U. )


A new technical paper titled "Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging" was published by researchers at Cambridge University. Abstract "Coefficients of thermal expansion (CTE) of various materials in packaging structure layers vary largely, causing significant thermomechanical stress in power electroni... » read more

Distribution of Currents In Via Arrays


It has become increasingly difficult in recent years to provide adequate PDNs on a PCB. The sheer number of different voltages, combined with increased current demands, makes distributing current around the board a substantial layout challenge. This paper demonstrates that by using appropriate and accurate simulations, combined with the improved intuition that such simulations bring, it is a ch... » read more

Three Ways To Speed Up Timing Closure Of High-Speed PCB Interfaces


On advanced high-speed interfaces, timing closure can be an iterative process that can be time-consuming and frustrating. PCB designers need techniques and tools to make the process more efficient, so they can contribute to an overall faster time to market for the design. This article discusses three ways that the new Cadence Allegro TimingVision environment speeds up timing closure of high-spe... » read more

CMOS Noise Margin Values


One of the most important parameters describing digital systems operating at high speed is noise margin. In a general sense, noise margins define an acceptable level of noise that can be present on an I/O pin or in an interface. In terms of digital electronics, noise margin characterizes the level of noise that can appear on an I/O pin without creating an error in a received logic state. This i... » read more

Weaving A Digital Thread For Design And Manufacture Of Additive Electronics


Additive manufacturing has been around electronics since thick-film, screened hybrids came on the scene more than 30 years ago. And while those never quite went away, they never gained the prominence we all expected alongside the more traditional laminated, subtractive-etched PCBs. Today, emerging technologies are bringing a resurgence in additive manufacturing, also known as printed electro... » read more

The Ultimate Guide To PCB Layout For GaN Transistors


In the ever-evolving landscape of power electronics, the emergence of gallium nitride (GaN) transistors has ignited a revolution by offering unparalleled benefits, including remarkable efficiency and power density enhancements. The art of PCB layout has been a crucial component in power electronic design for over four decades now, ever since the advent of switching power supplier. From the ea... » read more

AI PCB Design: How Generative AI Takes Us From Constraints To Possibilities


Generative artificial intelligence (AI) represents the next great step forward in PCB design. This is, of course, what you might expect me to say. 2023 has been a year dominated by the rise of generative AI, with large language models (LLMs) as the unquestionable poster child. It’s easy to see why; LLMs seemingly fulfill the promise of sentience, while in reality, they’re simply very goo... » read more

Stitching Together A Multi-Layer PCB PDN


A printed circuit board (PCB) is much like a complicated city, with a myriad of intertwined pathways for data signals and power. To meet the electric current needs of modern, high-powered integrated circuits (ICs), the power distribution network (PDN) usually consists of wide power planes on multiple layers to provide a low-resistance path for power delivery. These planes are stitched together ... » read more

EDA Posts Q4 2022 Revenue of $3.9B


The ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report that the Electronic System Design (ESD) industry revenue increased 11.3% from $3.47 billion in the fourth quarter of 2021 to $3.86 billion in the fourth quarter of 2022. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 12.6... » read more

Identifying PCB Defects with a Deep Learning Single-Step Detection Model


This new technical paper titled "End-to-end deep learning framework for printed circuit board manufacturing defect classification" is from researchers at École de technologie supérieure (ÉTS) in Montreal, Quebec. Abstract "We report a complete deep-learning framework using a single-step object detection model in order to quickly and accurately detect and classify the types of manufacturi... » read more

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