A new technical paper titled “Fault-marking: defect-pattern leveraged inherent fingerprinting of advanced IC package with thermoreflectance imaging” was published by researchers at University of Florida and University of Cincinnati.
“This work visits the existing challenges and limitations of traditional embedded fingerprinting and watermarking approaches, and proposes the notion of inherent hardware identifiers using Thermo-reflectance Imaging (TRI) and other imaging techniques as a new frontier of opportunity for effective security assurance of advanced IC packaging supply chain,” said Nitin Varshney, Lab Manager at the Florida Institute for Cyber Security (FICS) Research, University of Florida.
Find the technical paper here. Published October 2024. (note: SPIE sign-in or fee required to access beyond the abstract).
Nitin Varshney, Mohammad Shafkat M. Khan, Shajib Ghosh, Antika Roy, Je-Hyeong Bahk, and Navid Asadizanjani “Fault-marking: defect-pattern leveraged inherent fingerprinting of advanced IC package with thermoreflectance imaging”, Proc. SPIE 13145, Infrared Sensors, Devices, and Applications XIV, 131450A (3 October 2024); https://doi.org/10.1117/12.3027447.
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