Chip Industry Week In Review


Samsung unveiled its latest 2nm and 4nm process nodes, plus its AI solutions during the Samsung Foundry Forum. The company also introduced an aggressive roadmap for the next few years that includes 3D-ICs with logic-on-logic, starting in 2025; custom HBM with built-in logic; backside power delivery on 2nm technology in 2027; and co-packaged optics. In presentations at the event, the company als... » read more

Power/Performance Bits: March 3


Optimizing fiber networks Researchers at Chalmers University of Technology are working towards reducing the energy consumption of fiber optic communications before the amount of electricity required by the Internet becomes too great to manage. To improve overall efficiency, the team tackled several aspects of fiber optic cables. One of the major energy drains the team identified was the err... » read more