The Week In Review: June 7

By Ed Sperling - 07 Jun, 2013 - Comments: 0

By Ed Sperling For all the hesitation about moving the Design Automation Conference to Austin, it turns out that Austin has a lot of hardware engineers. In fact they flooded into the conference, turning it into one of the most successful in recent years and setting new records in multiple areas. Even Texas Gov. Rick Perry showed up to see what all the fuss was about. Mentor Graphics added c... » read more

Scaling The Lowly SRAM

By Mark LaPedus - 05 Jun, 2013 - Comments: 0

By Mark LaPedus Chipmakers face a multitude of challenges at the 20nm logic node and beyond, including the task of cramming more functions on the same chip without compromising on power and performance. There is one major challenge that is often overlooked in the equation—scaling the lowly static RAM (SRAM). In one key application, SRAM is the component used to make on-chip cache memories... » read more

Tech Talk: FinFETs, FD-SOI And The Future Of SoC Design

By Ed Sperling - 04 Jun, 2013 - Comments: 0

Mary Ann White, marketing manager for Synopsys' Galaxy Implementation Platform, talks with Low-Power/High-Performance Engineering about new opportunities to reduce power and improve performance, and where the pain points will be. [youtube vid=kuJdcHIRxfU] » read more

EUV Flare And Proximity Modeling And Model-Based Correction

By Various Writers - 16 May, 2013 - Comments: 0

The introduction of EUV lithography into the semiconductor fabrication process will enable a continuation of Moore’s law below the 22 nm technology node. EUV lithography will, however, introduce new and unwanted sources of patterning distortions which must be accurately modeled and corrected on the reticle. Flare caused by scattered light in the projection optics is expected to result in seve... » read more

Bigger Wafers, Bigger Risk

By Ed Sperling - 16 May, 2013 - Comments: 0

At 22/20/16/14nm the semiconductor industry is experiencing a rather new twist on Moore’s Law. Smaller, as in smaller feature sizes, is no longer assumed to be cheaper—or at least not for everyone. In fact, the cost per transistor for the first time in more than half a century could rise in some cases. Whether this outlook improves as the semiconductor industry gains more experience wit... » read more

FinFET Isolation: Bulk vs. SOI

By Various Writers - 15 May, 2013 - Comments: 1

Terry Hook of IBM recently contributed an article to ASN about FinFET isolation issues on bulk vs. SOI. It generated immense interest, and created lots of discussion on various LinkedIn groups. In case you missed it, here it is again. (This article is based on an in-depth presentation Terry gave at the SOI Consortium's Fully-Depleted Tech Workshop, held during VLSI-TSA in Taiwan, April 2... » read more

Experts At The Table: FinFET Questions And Issues

By Ed Sperling - 19 Apr, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss the current state and future promise of finFETs, and the myriad challenges, with Ruggero Castagnetti, an LSI fellow; Barry Pangrle, senior power methodology engineer at Nvidia; Steve Carlson, group director of marketing at Cadence; and Mary Ann White, director of product marketing at Synopsys. What follows are excerpts o... » read more

Foundry Models In Transition

By Jeff Chappell - 18 Apr, 2013 - Comments: 0

By Jeff Chappell There may have been a time when AMD founder Jerry Sanders famous quote: "real men (i.e., real companies) have their own fabs” rang true, but in today's business climate it seems quaint at best. Fabless or fab-lite business models are more popular than ever today, while some IDMs have turned back the clock, so to speak, looking to improve capacity utilization and revenues ... » read more

GF’S Two Flavors Of FD-SOI

By Various Writers - 17 Apr, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~ ~ Hearing the news that GlobalFoundries would be offering two flavors of FD-SOI, ASN asked the company to explain the strategy further. Here are the responses provided by Subi Kengeri, Vice President of Advanced Technology Architecture. [caption id="" align="alignleft" width="110"] Subi Kengeri, VP Advanced T... » read more

Executive Briefing: Wally Rhines

By Ed Sperling - 28 Mar, 2013 - Comments: 0

By Ed Sperling System-Level Design, as part of its ongoing executive briefing series, sat down with Wally Rhines, Mentor Graphics' chairman and CEO, to talk about future problems, opportunities, and the gray areas that could go either way. What follows are excerpts of that conversation. SLD: Is the amount of time spent on verification increasing? Rhines: It depends on how you define who s... » read more

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