180nm HVIC Technology for Digital AC/DC Power Conversion


This paper presents a new high-voltage integrated circuit (HVIC) technology that is optimized for AC/DC power conversion applications with increased digital content. The cost-effective process uses 3.3V CMOS and a 180nm backend process to provide about 10X greater digital circuit density compared with conventional 0.5μm 5V CMOS solutions while maintaining excellent analog circuit performance. ... » read more

Experts At The Table: Changes In The Ecosystem


By Ed Sperling Semiconductor Manufacturing & Design sat down with Michael Buehler-Garcia, director of design solutions marketing at Mentor Graphics; Seow Yin Lim, group director for marketing at Cadence; Kevin Kranen, director of strategic alliances at Synopsys, and Tom Quan, director at TSMC. What follows are excerpts of that conversation. SMD: How are chipmakers working with the rest ... » read more

Leveraging The Past


By Ann Steffora Mutschler It’s easy to forget that not every design today is targeted at 20nm, given the amount of focus put on the bleeding edge of technology. But in fact a large number of designs utilize the stability and reliability of older manufacturing nodes, as well as lower mask costs, by incorporating new design and verification techniques, with 2.5D designs being a prime example. ... » read more