tag: 2.5D

The Future Of Memory (Part 2)
By Ed Sperling - 13 Jul, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss future memory with Frank Ferro, senior director of product management for memory and interface IP at [getentity id="22671" e_name="Rambus"]; Marc Greenberg, director of product marketing at [getentity id="22035" e_name="Synopsys"]; and Lisa Minwell, [getentity id="22242" e_name="eSilicon"]'s senior director of IP marketing. What follows are excerpt... » read more

Securing Chips During Manufacturing
By Ed Sperling - 07 Jul, 2016 - Comments: 0

David Lam, chairman of Multibeam, sat down with Semiconductor Engineering to talk about how next-gen lithography tools can be used to prevent cyber attacks and counterfeiting of hardware. SE: How did you get into the anti-counterfeiting business? Lam: About three years ago we were working with some customers that were troubled by the counterfeiting problem. We became aware of that sense o... » read more

Uncertainty Rocks Chip Market
By Ed Sperling - 30 Jun, 2016 - Comments: 1

The semiconductor industry is undergoing sweeping changes in every direction, making it far more difficult to figure out which path to take next, when to take it, and how to get there. The next few years will redefine which semiconductor companies emerge as leaders, which ones get pushed down or out or absorbed into other companies, and which markets will be the most lucrative. And that coul... » read more

Interconnect Challenges Rising
By Mark LaPedus - 27 Jun, 2016 - Comments: 1

Chipmakers are ramping up their 14nm finFET processes, with 10nm and 7nm slated to ship possibly later this year or next. At 10nm and beyond, IC vendors are determined to scale the two main parts of the [getkc id="185" kc_name="finFET"] structure—the transistor and interconnects. Generally, transistor scaling will remain challenging at advanced nodes. And on top of that, the interconnects ... » read more

The Road To 5nm
By Ed Sperling - 23 Jun, 2016 - Comments: 1

There is strong likelihood that enough companies will move to 7nm to warrant the investment. How many will move forward to 5nm is far less certain. Part of the reason for this uncertainty is big-company consolidation. There are simply fewer customers left who can afford to build chips at the most advanced nodes. Intel bought Altera. Avago bought Broadcom. NXP bought Freescale. GlobalFoundrie... » read more

Advanced Packaging Options, Issues
By Ed Sperling - 23 Jun, 2016 - Comments: 0

Systems in package are heading for the mass market in applications that demand better performance and lower power. As they do, new options for cutting costs are being developed to broaden the appeal of this approach as an alternative to shrinking features. Cost has been one of the big deterrents for widespread adoption of [getkc id="82" kc_name="2.5D"]. Initially, the almost universal compla... » read more

Photonics Moves Closer To Chip
By Ed Sperling - 20 Jun, 2016 - Comments: 0

Silicon photonics is resurfacing after more than a decade in the shadows, driven by demands to move larger quantities of data faster, using extremely low power and with minimal heat. Until recently, much of the attention in photonics focused on moving data between servers and storage. Now there is growing interest at the PCB level and in heterogeneous multi-chip packages. Government, academi... » read more

Performance First
By Ed Sperling - 16 Jun, 2016 - Comments: 0

Crank up the clock speed. It takes a lot more performance to run virtual reality smoothly, or to process data in the cloud, or to stream a high-definition video from a drone. And none of that compares to the amount of performance required to kill an array of disturbingly realistic zombies on a mobile device in conjunction with other players scattered around the globe. After several years of ... » read more

The Future Of Memory
By Ed Sperling - 16 Jun, 2016 - Comments: 2

Semiconductor Engineering sat down to discuss future memory with Frank Ferro, senior director of product management for memory and interface IP at [getentity id="22671" e_name="Rambus"]; Marc Greenberg, director of product marketing at [getentity id="22035" e_name="Synopsys"]; and Lisa Minwell, [getentity id="22242" e_name="eSilicon"]'s senior director of [getkc id="43" kc_name="IP"] marketing.... » read more

How To Build Systems In Package
By Ed Sperling - 15 Jun, 2016 - Comments: 0

The semiconductor industry is racing to define a series of road maps for semiconductors to succeed the one created by the ITRS, which will no longer be updated, including a brand new one focused on heterogeneous integration. The latest entry will establish technology targets for integration of heterogeneous multi-die devices and systems. It has the support of IEEE's Components, Packaging and... » read more

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