tag: 28nm

A Strategy For Designing For Power With FinFETs
By Anand Iyer - 11 Sep, 2015 - Comments: 0

Recently Qualcomm announced their new SnapDragon processor 820, which was designed using finFET technology. They showed some amazing results, such as 2X improvement in performance and 2X improvement in power compared to 28nm designs. Previously, when ARM announced their A72 processors in finFET, they too had claimed 3.5X improvement in power compared to 28nm designs. But can designers expect... » read more

Challenges At Advanced Nodes
By Ed Sperling - 19 Aug, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss finFETs, 22nm FD-SOI and how the how the market will segment over the next few years with Marie Semeria, CEO of [getentity id="22192" e_name="Leti"]; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Paul Boudre, CEO of Soitec; and Subramani Kengeri, vice president of global ... » read more

Moving Electrons Is Getting Harder
By Ed Sperling - 13 Aug, 2015 - Comments: 1

Numerous executives across the ecosystem—from EDA and equipment companies to foundries—recently have stated that Moore's Law has at least 10 more years of life. This is interesting math, considering the semiconductor industry is now working on 10nm, with chips expected to roll out next year. So given that Moore's Law is on a two-year cadence of doubling the number of transistors every 24... » read more

Which Process, Material, IP?
By Ed Sperling - 30 Jul, 2015 - Comments: 1

For years chipmakers have been demanding more choices. They've finally gotten what they wished for—so many possibilities, in fact, that engineering teams of all types are having trouble wading through them. And to make matters worse, some choices now come with unexpected and often unwanted caveats. At the most advanced nodes it's a given that being able to shrink features and double patter... » read more

The Great Imbalance
By Ed Sperling - 23 Jul, 2015 - Comments: 2

The number of options for chipmakers is growing while the number of chipmakers is shrinking. So what does this mean for the semiconductor industry? Short answer: No one is quite sure yet. But a lot more people are beginning to ask that question these days, including investors and analysts. There are a number of factors at play here. To begin with, there are more nodes to choose from than at ... » read more

Inside Samsung’s Foundry Biz
By Mark LaPedus - 23 Jul, 2015 - Comments: 0

Semiconductor Engineering sat down to talk about the foundry business, process technology, design and other topics with Hong Hao, senior vice president of the foundry business at [getentity id="22865" e_name="Samsung Semiconductor"]; and Kelvin Low, senior director of foundry marketing at Samsung Semiconductor. What follows are excerpts of that discussion. SE: The foundry business has alway... » read more

What Will 7nm And 5nm Look Like?
By Mark LaPedus - 23 Jul, 2015 - Comments: 0

Citing an assortment of undisclosed manufacturing issues, Intel in July pushed out the introduction of its 10nm chip and process technology to the second half of 2017. This is roughly six or more months later than expected. With the delay at 10nm, [getentity id="22846" e_name="Intel"] also pushed out its process cadence from 2 to 2.5 years. Other foundries, meanwhile, are struggling to keep ... » read more

IP Integration Challenges Increase
By Ed Sperling - 08 Jul, 2015 - Comments: 0

Semiconductor Engineering sat down with Chris Rowen, CTO of [getentity id="22032" e_name="Cadence"]'s IP group; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Navraj Nandra, senior director of marketing for DesignWare analog and mixed-signal IP at [getentity ... » read more

IP Integration Challenges Increase
By Ed Sperling - 24 Jun, 2015 - Comments: 0

Semiconductor Engineering sat down with Chris Rowen, CTO of [getentity id="22032" e_name="Cadence"]'s IP group; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Navraj Nandra, senior director of marketing for DesignWare analog and mixed-signal IP at [getentity ... » read more

Foundries Expand Planar Efforts
By Mark LaPedus - 18 Jun, 2015 - Comments: 0

Competition is heating up in the leading-edge foundry business, as vendors begin to ramp up their new 16nm/14nm finFET processes. But that’s not the only action in the foundry arena. They are also expanding their efforts in the leading-edge planar market by rolling out new 28nm and 22nm processes. On one front, TSMC is offering new 28nm variants, based on bulk CMOS technology. And on an... » read more

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