Analog Evolves Into Mixed Signal

By Linh Hong - 06 Aug, 2015 - Comments: 0

Predictions about the Internet of Things suggest this may be the new “Killer App,” something the semiconductor industry has long been looking for. Reinforcing the forecasts are television commercials from companies such as Cisco and GE touting the IoT’s impact on everything from jet engines to robots, capturing everyone’s imagination. New categories of products such as smartwatches will... » read more

10nm Fab Watch

By Mark LaPedus - 21 May, 2015 - Comments: 1

When will the 10nm logic node happen? Analysts believe that foundry vendors will move into 10nm finFET volume production around 2017. Still others say the 10nm finFET ramp could take place anywhere from 2018 to 2020. The predictions are all over the map. One way to predict the timing, progress and demand for 10nm is simple: Follow the fabs. In fact, Intel, Samsung, TSMC and GlobalFound... » read more

“Make in India”

By SEMI - 19 Mar, 2015 - Comments: 0

By Bettina Weiss In recent weeks, I have been talking to SEMI members and other stakeholders about India. Some consider any semiconductor industry development in the country a dream. Others are looking more closely at current indicators of something real and tangible, trying to determine whether to get involved. The electronics sector in India will have to satisfy a huge demand growth... » read more

Manufacturing Constraint Fears Grow

By Ed Sperling - 18 Dec, 2014 - Comments: 0

The semiconductor industry could become a victim of its own success. With so many semiconductors being consumed inside of cars, home electronics and industry, capacity shortages are beginning to surface in some areas. Foundries set rates depending upon a complex mix of process technology, equipment depreciation, customer demand and the need to push customers from one node the next depending ... » read more

Navigating The Used Equipment Market

By Mark LaPedus - 18 Sep, 2014 - Comments: 0

For years, the used semiconductor equipment market has been an important but obscure part of the IC manufacturing supply chain. In fact, nearly all chipmakers have bought used tools over the years. Buying used equipment is a quick and relatively inexpensive way to fill a particular need in both 200mm and 300mm fabs. But after years of flying under the radar, the used IC equipment market is h... » read more

EUV Is Key To 450mm Wafers

By Katherine Derbyshire - 31 Jul, 2014 - Comments: 1

Whether the wafers in question are 200 mm in diameter, or 300 mm, or potentially 450 mm, larger wafer sizes have always been justified by manufacturing economics. If the cost to process a wafer stays the same, but the wafer contains more devices, then the cost per device goes down. For processes that apply to the entire wafer at once — etch, deposition, cleaning, and so forth — the equation... » read more

Is 450mm Dead In The Water?

By Mark LaPedus - 15 May, 2014 - Comments: 3

At one time, Intel, TSMC and Samsung were aggressively beating the 450mm drum. Chipmakers wanted, if not demanded, 450mm pilot line fabs by 2016, with high-volume manufacturing 450mm plants slated by 2018. At least for those companies, 450mm made some sense. Moving to 450mm wafers would supposedly give chipmakers a 2.25x boost in wafer area and a 30% cost reduction over 300mm substrates. But... » read more

Experts At The Table: 450mm Fab And Facilities Challenges

By Mark LaPedus - 18 Jul, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future 450mm fab and facilities challenges with Gerald Goff, director of the project management office for fab design and construction at GlobalFoundries; Joe Cestari, president of Total Facility Solutions; Ivo Raaijmakers, chief technology officer of ASM International; and Michael Brain, senior director of the Fab S... » read more

Foundries Eye 300mm Analog Fabs

By Mark LaPedus - 18 Jul, 2013 - Comments: 0

By Mark LaPedus In 2009, Texas Instruments changed the semiconductor landscape when it opened the industry’s first 300mm fab for analog chips. Until then, analog chip production was conducted in fabs at 200mm wafer sizes and below. With a 300mm fab, TI potentially could gain a die-size and cost advantage over its analog rivals. On paper, a 300mm wafer provides 2.5 times more chips than a... » read more

High NA EUV Litho May Require Larger Photomask Size

By Jeff Chappell - 18 Jul, 2013 - Comments: 0

By Jeff Chappell With extreme ultraviolet lithography (EUV) potentially being used in pilot production in a few years, it raises the question of larger photomasks sizes—will the industry need them, and if so, when? While there has been discussion of late about the possible need to transition to a larger mask size, veterans of the mask business may feel it's déjà vu all over again. Back... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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