tag: 3D DRAM

Is In-Memory Compute Still Alive?
By Bryon Moyer - 12 Dec, 2024 - Comments: 0

In-memory computing (IMC) has had a rough go, with the most visible attempt at commercialization falling short. And while some companies have pivoted to digital and others have outright abandoned the technology, developers are still trying to make analog IMC a success. There is disagreement regarding the benefits of IMC (also called compute-in-memory, or CIM). Some say it’s all about reduc... » read more

HBM Options Increase As AI Demand Soars
By Laura Peters - 21 Nov, 2024 - Comments: 0

High-bandwidth memory (HBM) sales are spiking as the amount of data that needs to be processed quickly by state-of-the-art AI accelerators, graphic processing units, and high-performance computing applications continues to explode. HBM inventories are sold out, driven by massive efforts and investments in developing and improving large language models such as ChatGPT. HBM is the memory of ch... » read more

Memory Fundamentals For Engineers
By The SE Staff - 17 Sep, 2024 - Comments: 0

Memory is one of a very few elite electronic components essential to any electronic system. Modern electronics perform extraordinarily complex duties that would be impossible without memory. Your computer obviously contains memory, but so does your car, your smartphone, your doorbell camera, your entertainment system, and any other gadget benefiting from digital electronics. This eBook prov... » read more

3D Metrology Meets Its Match In 3D Chips And Packages
By Laura Peters - 11 Jun, 2024 - Comments: 0

The pace of innovation in 3D device structures and packages is accelerating rapidly, driving the need for precise measurement and control of feature height to ensure these devices are reliable and perform as expected throughout their lifetimes. Expansion along the z axis is already well underway. One need look no further than the staircase-like 3D NAND stacks that rise like skyscrapers to p... » read more

Review Of Virtual Wafer Process Modeling And Metrology For Advanced Technology Development
By Coventor - 17 Apr, 2024 - Comments: 0

Semiconductor logic and memory technology development continues to push the limits of process complexity and cost, especially as the industry migrates to the 5 nm node and beyond. Optimization of the process flow and ultimately quantifying its physical and electrical properties are critical steps in yielding mature technology. The standard build, test, and wait model of technology development ... » read more

3D Memory Structures: Common Hole And Tilt Metrology Techniques and Capabilities
By Technical Paper Link - 03 Jun, 2023 - Comments: 0

A technical paper titled "Inline metrology of high aspect ratio hole tilt and center line shift using small-angle x-ray scattering" was published by researchers at Bruker Nano and Lam Research. Abstract: "High aspect ratio (HAR) structures found in three-dimensional nand memory structures have unique process control challenges. The etch used to fabricate channel holes several microns deep... » read more

Devices And Transistors For The Next 75 Years
By Laura Peters - 16 Feb, 2023 - Comments: 0

The 75th anniversary of the invention of the transistor sparked a lively panel discussion at IEDM, spurring debate about the future of CMOS, the role of III-V and 2D materials in future transistors, and what will be the next great memory architecture.[1] Industry veterans from the memory, logic, and research communities see high-NA EUV production, NAND flash with 1,000 layers, and hybrid bon... » read more

Wafer Cleaning Becomes Key Challenge In Manufacturing 3D Structures
By Adele Hars - 20 Oct, 2022 - Comments: 0

Wafer cleaning, once a rather mundane task as simple as dipping wafers in cleaning fluid, is emerging as one of the top major engineering challenges for manufacturing GAA FETs and 3D-ICs. With these new 3D structures — some on the horizon but some already in high-volume manufacturing — semiconductor wafer equipment and materials suppliers in the wet cleaning business are at the epicenter... » read more

Week In Review: Manufacturing, Test
By Linda Christensen - 15 Apr, 2022 - Comments: 0

Photonic Chips Go Big In Europe PhotonDelta, a collaborative end-to-end supply chain for the application of photonics chips, secured €1.1 billion in conditional funding for a six-year initiative. Investments from the Netherlands government and other organizations “will be used to build 200 startups, scale up production, create new applications for photonic chips, and develop infrastructure... » read more

The Race To Much More Advanced Packaging
By Mark LaPedus - 23 Jul, 2020 - Comments: 2

Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are developing copper hybrid bonding, which is a process that stacks and bonds dies using copper-to-copper interconnects in advanced packages. Still in R&D, hybrid bonding for packaging provides mo... » read more

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