Rethinking Power


Power typically has been the last factor to be considered in the PPA equation, and it usually was somebody else's problem. Increasingly it's everyone's problem, and EDA companies are beginning to look at power differently than in the past. While the driving forces vary by market and by process node, the need to save energy at every node and in almost all designs is pervasive. In the server m... » read more

How Switching Activity Impacts A Design’s Power And Reliability


Electronics continue to gain presence in both familiar and unfamiliar areas of our lives. Electronics is a common thread among the cars we drive, the computers we use, the mobile phones and wearable devices that we rely on. We appreciate the information and convenience that Fitbits and other products such as coffee makers, credit cards and building security cards provide us. And we are beginni... » read more

FD-SOI Vs. FinFETs


Semiconductor Engineering sat down to compare the benefits, risks and challenges of moving to finFETs compared with fully depleted silicon on insulator ([getkc id="220" kc_name="FD-SOI"]) with Philippe Magarshack, group vice president for technology R&D at [getentity id="22331" comment="STMicroelectronics"]; Marco Brambilla, director of engineering at [getentity id="22150" e_name="Synapse D... » read more

Pressure Builds To Revamp The Design Flow


Without [getkc id="7" kc_name="EDA"] there would be no [getkc id="74" comment="Moore's Law"] as we know it today, and without Moore's Law there would be a much more limited need for EDA. But after more than three decades of developing design flows packed with sophisticated tools to automate semiconductor design through verification, and thereby enable feature shrinks that are the basis of Moore... » read more

Making It Differently


Anyone who hasn't bought into the IoT/E as a fundamental shift in electronics should check out what's happening in China. All appliances and electronics being developed for the home market are now being sold as smart-ready. This is a market that comprises roughly one-fifth (19.4% to be exact) of the world's population. In the future, whether or not you hook up a new washing machine or TV to ... » read more

Partition Lines Growing Fuzzy


For as long as most semiconductor engineers can remember, chips with discrete functions started out on a printed circuit board, progressed into chip sets when it made sense and eventually were integrated onto the same die. The primary motivations behind this trend were performance and cost—shorter distance, fewer mask layers, less silicon. But this equation has been changing over the past ... » read more

One-On-One: Dave Hemker


Semiconductor Engineering sat down to discuss process technology, transistor trends and other topics with Dave Hemker, senior vice president and chief technology officer at [getentity id="22820" comment="LAM Research"]. SE: On the technology front, the IC industry is undergoing some new and dramatic changes. What are some of those changes? Hemker: We focus on what we call the inflections.... » read more

Back To The Future


The push to the next process node typically has meant that designs get simpler at existing and older nodes because the process technology is more mature and there have been so many chips developed at those nodes—many billions of them—that every possible corner case has been encountered hundreds, if not thousands, of times. That all makes sense in theory, but several key things have chang... » read more

Manufacturing And Packaging Changes For 2015


This year more than 26 people provided predictions for 2015. Most of these came from the EDA industry, so the results may be rather biased. However, ecosystems are coming closer together in many parts of the semiconductor food chain, meaning that the EDA companies often can see what is happening in dependent industries and in the system design houses. Thus their predictions may have already res... » read more

One-On-One: Aaron Thean


Semiconductor Engineering sat down to discuss process technology, transistor trends and other topics with Aaron Thean, vice president of process technologies and director of the logic devices R&D program at Imec. SE: Chipmakers are ramping up the 16nm/14nm logic node, with 10nm and 7nm in R&D. What’s the current timeline for 10nm and 7nm? Thean: 10nm is on its way. We will see r... » read more

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