tag: 3D NAND

Dealing With Atoms
By Mark LaPedus - 13 Jul, 2015 - Comments: 0

Chipmakers are ramping up a new range of device architectures, such as 3D NAND and finFETs. But to enable current and future devices, IC vendors will require new breakthroughs, including tools that can process tiny structures and films, even at the atomic level. The problem? There are gaps in terms of techniques that can process chips at the atomic level. Looking to help fill part of the ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Jul, 2015 - Comments: 0

An alliance led by IBM Research has produced the semiconductor industry’s first 7nm test chips with functioning transistors. The breakthrough, accomplished in partnership with GlobalFoundries and Samsung at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering, could result in the ability to place more than 20 billion tiny switches, or transistors, on a chip. There i... » read more

Getting Over Overlay
By Mark LaPedus - 18 Jun, 2015 - Comments: 0

Chipmakers continue to migrate to the next node, but there are signs that traditional IC scaling is slowing down. So what’s causing the slowdown? Or for that matter, what could ultimately undo [getkc id="74" comment="Moore's Law"]? It could be a combination of factors. To be sure, IC design costs and complexity are soaring at each node. Scaling challenges are also playing a role. And ov... » read more

10nm Fab Challenges
By Mark LaPedus - 21 May, 2015 - Comments: 1

After a promising start in 2015, the semiconductor equipment industry is currently experiencing a slight lull. The pause is expected to be short-lived, however. Suppliers of [getkc id="208" comment="3D NAND"] devices are expected to add more fab capacity later this year. And about the same time, foundries are expected to order the first wave of high-volume production tools for 10nm. At 10nm... » read more

Waiting For Next-Gen Metrology
By Mark LaPedus - 21 May, 2015 - Comments: 0

Chipmakers continue to march down the various process nodes, but the industry will require new breakthroughs to extend IC scaling at 10nm and beyond. In fact, the industry will require innovations in at least two main areas—patterning and the [getkc id="36" comment="Interconnect"]. There are other areas of concern, but one technology is quickly rising near the top of the list—metrology.... » read more

Flash Dance For Inspection And Metrology
By Mark LaPedus - 16 Apr, 2015 - Comments: 0

Chipmakers are moving from planar technology to an assortment of 3D-like architectures, such as 3D NAND and finFETs For these devices, chipmakers face a multitude of challenges in the fab. But one surprising and oft-forgotten technology is emerging as perhaps the biggest challenge in both logic and memory—process control. Process control includes metrology and wafer inspection. Metrolo... » read more

The Week In Review: Design/IoT
By Jesse Allen - 27 Mar, 2015 - Comments: 0

Tools Mentor Graphics uncorked its new IC, package, and PCB co-design and optimization product. It includes a formal flow for ball grid array ball-map planning and optimization based on an "intelligent pin" concept and a multi-mode connectivity management system for cross-domain pin-mapping and system level cross-domain logical verification. Synopsys released a new tool for designing ASIP... » read more

3D NAND Market Heats Up
By Mark LaPedus - 19 Feb, 2015 - Comments: 4

After some delays and uncertainty in past years, the 3D NAND market is finally heating up. In 2013 and 2014, Samsung was the only vendor participating in the 3D NAND market. Most other suppliers were supposed to ship 3D NAND devices in volumes last year, but vendors pushed out their production dates for various business and technical reasons. Going into 2015, [getentity id="22865" e_nam... » read more

One-On-One: Dave Hemker
By Mark LaPedus - 19 Feb, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss process technology, transistor trends and other topics with Dave Hemker, senior vice president and chief technology officer at [getentity id="22820" comment="LAM Research"]. SE: On the technology front, the IC industry is undergoing some new and dramatic changes. What are some of those changes? Hemker: We focus on what we call the inflections.... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 Jan, 2015 - Comments: 0

This week, IBM began to cut jobs amid lackluster results. Big Blue is also in the process of selling its chip unit to GlobalFoundries. GlobalFoundries said the jobs are safe at IBM Micro, at least for now, according to a report the Press and Sun-Bulletin. What’s the latest with Applied Materials’ proposed acquisition with Tokyo Electron Ltd. (TEL)? “Germany, Israel and Singapore approv... » read more

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