What’s In A Node?


In an environment where process nodes are no longer consistently delivering the level of improvements predicted by Moore’s Law, the industry will continue to develop “inter-nodes” as a way to deliver incremental improvements in lieu of “full-nodes.” A shift in market requirements, in part due to the rise of AI and IoT, is increasing emphasis on trailing-nodes. When it comes to leading... » read more

Architecture, Materials And Software


AI, machine learning and autonomous vehicles will require massive improvements in performance, at the same power consumption level (or better), over today's chips. But it's obvious that the usual approach of shrinking features to improve power/performance isn't going to be sufficient. Scaling will certainly help, particularly on the logic side. More transistors are needed to process a huge i... » read more

New Nodes, Materials, Memories


Ellie Yieh, vice president and general manager of Advanced Product Technology Development at [getentity id="22817" e_name="Applied Materials"], and head of the company's Maydan Technology Center, sat down with Semiconductor Engineering to talk about challenges, changes and solutions at advanced nodes and with new applications. What follows are excerpts of that conversation. SE: How far can w... » read more

What’s Next in 3D NAND?


In 2018, the industry needs to keep a close eye on 3D NAND as the vendor base is in the midst of some major changes. The changes involve several partnerships, including the Toshiba/Western Digital and Intel/Micron duos. It also impacts the other 3D NAND players, namely Samsung and SK Hynix. But first, demand for NAND flash memory remains robust due to the onslaught of data in systems. ... » read more

A New Memory Contender?


Momentum is building for a new class of ferroelectric memories that could alter the next-generation memory landscape. Generally, ferroelectrics are associated with a memory type called ferroelectric RAMs (FRAMs). Rolled out by several vendors in the late 1990s, FRAMs are low-power, nonvolatile devices, but they are also limited to niche applications and unable to scale beyond 130nm. While... » read more

The Next 5 Years Of Chip Technology


Semiconductor Engineering sat down to discuss the future of scaling, the impact of variation, and the introduction of new materials and technologies, with Rick Gottscho, CTO of [getentity id="22820" comment="Lam Research"]; Mark Dougherty, vice president of advanced module engineering at [getentity id="22819" comment="GlobalFoundries"]; David Shortt, technical fellow at [getentity id="22876" co... » read more

Pushing DRAM’s Limits


If humans ever do create a genuinely self-aware artificial intelligence, it may well exhibit the frustration of waiting for data arrive. The access bandwidth of DRAM-based computer memory has improved by a factor of 20x over the past two decades. Capacity increased 128x during the same period. But latency improved only 1.3x, according to Kevin Chang, a researcher at Carnegie Mellon Universit... » read more

Memory Test Challenges, Opportunities


The semiconductor capital equipment market is on fire, and the memory chip test equipment sector is no different. But it is getting much more difficult on the memory side. Memory test vendors are contending with next-generation devices, such as 3D NAND flash memories, HBM2 chips, low-power double-data-rate DRAMs, graphics DRAMs, phase-change memories, magnetoresistive RAMs, and resistive RAM... » read more

What Happened To ReRAM?


Resistive RAM (ReRAM), one of a handful of next-generation memories under development, is finally gaining traction after years of setbacks. Fujitsu and Panasonic are jointly ramping up a second-generation ReRAM device. In addition, Crossbar is sampling a 40nm ReRAM technology, which is being made on a foundry basis by China’s SMIC. And not to be outdone, TSMC and UMC recently put ReRAM on ... » read more

What Is Spin Torque MRAM?


The memory market is going in several different directions at once. On one front, the traditional memory types, such as DRAM and flash, remain the workhorse technologies. Then, several vendors are readying the next-generation memory types. As part of an ongoing series, Semiconductor Engineering will explore where the new and traditional memory technologies are heading. For this segment, P... » read more

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