Has The IC Industry Hit A ‘Red Brick Wall’?

By Mark LaPedus - 19 Jun, 2014 - Comments: 2

In the mid-1980s, the semiconductor industry was in a crisis. Chipmakers were looking for ways to break the magical one-micron barrier. Many thought X-ray lithography would be required to break the barrier, but as it turned out, traditional optical technology did the trick. And the industry marched on. Then, in 2000 or so, the IC industry was nearing the so-called “red brick wall,” which... » read more

Executive Insight: Hossein Yassaie

By Ed Sperling - 28 May, 2014 - Comments: 1

SE: What concerns you looking out at the semiconductor industry? Yassaie: There are big changes in the industry over the last two years, such as the verticalization in the mobile space. Every semiconductor company wanted to play in mobile. It was just a fact of life that some of these guys would give up. That was a major change, and it was something we could see coming. Our focus is diverse ... » read more

Manufacturing Bits: May 20

By Mark LaPedus - 20 May, 2014 - Comments: 0

Brain chips Pennsylvania State University has developed a technology that could enable futuristic biochips, namely those that mimic the human brain. In the lab, Penn State combined a thin film of vanadium dioxide (VO2) on a titanium dioxide substrate to create an oscillating switch. VO2 is an exotic material that exhibits semiconductor-to-metal transitions at 68 °C. In the R&D stage fo... » read more

Follow The Investments

By Ed Sperling - 24 Apr, 2014 - Comments: 0

Where is design heading over the next few years. The best way to tell that is to find out where the development dollars are going, and foundries and tools always precede actual designs. The foundries are starting to spend money—lots of it—on finFETs and 28nm. And while they’re talking about 2.5D and 3D, the money isn’t going there just yet. In fact, there are two different processes ... » read more

Searching For Rare Earths

By Mark LaPedus - 17 Apr, 2014 - Comments: 2

The semiconductor industry is pre-occupied with several and expensive technologies at once. One the device side, the industry is looking at new chip architectures, such as 3D NAND, finFETs and stacked die. On the manufacturing front, there is 450mm technology, next-generation lithography (NGL) and new materials. And that’s just the tip of the iceberg. Another technology that deserve... » read more

Power Moves Up To First Place

By Ed Sperling - 10 Apr, 2014 - Comments: 2

Virtually every presentation delivered about semiconductor design or manufacturing these days—and every end product specification that uses advanced technology—incorporates some reference to power and/or energy. It has emerged as the most persistent, most problematic, and certainly the most talked about issue from conception to marketplace adoption. And the conversation only grows louder... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 07 Mar, 2014 - Comments: 0

The smartphone market is maturing and slowing down. Now, according to International Data Corp. (IDC), the total tablet market, inclusive of both tablets and 2-in-1 devices, is forecast to grow 19.4% in 2014, down from a growth rate of 51.6% in 2013. IDC also reduced the 2014 forecast by -3.6% from its previous projection to 260.9 million units worldwide. The reduction in the short-term forecast... » read more

The Final Deadline For EUV

By Ed Sperling - 27 Feb, 2014 - Comments: 5

When TSMC disclosed this week—in a public forum—that its production EUV lithography test had failed in one of the early test runs due to a power source issue, there were very different reactions. EUV, after all, is an emotional issue with billions of dollars invested and lots of jobs riding on this technology. To begin with, there has been the usual spin control. The message essentially ... » read more

Manufacturing Bits: Feb. 18

By Mark LaPedus - 18 Feb, 2014 - Comments: 1

Polite cupcake helping robots Cornell and Carnegie Mellon have made a new discovery about robots. If they sound less snippy when they communicate, listeners will respond better. In fact, developers of robots should develop systems that use less confrontational language. In the study, entitled “How a Robot Should Give Advice,” researchers discovered that robots and humans are more lik... » read more

Manufacturing Bits: Feb. 11

By Mark LaPedus - 11 Feb, 2014 - Comments: 1

Monolithic 3D SRAM project A group of companies have started a research project to propel the development of monolithic 3D chip technology. The research project, called COMPOSE³, involves the ability to stack transistors vertically. Within three years, the group hopes to unveil a proof of concept for building the world’s first 14nm, 3D-stacked SRAM cell based on III-V materials. Co... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: 3D