tag: 5G

The New Technology Solutions For Advanced SiP Devices
By YongJai Seo - 21 Oct, 2021 - Comments: 0

For many years, system-in-package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased complexity and higher package density for SiP devices has driven the development of new packaging technologies. In response, compartmental shield technology makes it possible to put several functions int... » read more

Improving Accuracy In Satellite Navigation Systems
By Bryon Moyer - 20 Oct, 2021 - Comments: 0

Increasing dependency on the global navigation satellite system (GNSS) constellations is raising concerns about what happens when signals are unavailable, even for short periods of time. GNSS systems affect our daily lives in ways we often don’t see, from location services to cell phone timing. In fact, these satellites have become a necessary part of critical infrastructure, and higher ac... » read more

Security Risks Grow With 5G
By John Koon - 07 Oct, 2021 - Comments: 0

5G mobile phones can download a movie in seconds rather than minutes, but whether that can be done securely remains to be seen. What is clear from technology providers, though, is they are taking security very seriously with this new wireless technology. More data is in motion, and the value of that data is growing as users rely on mobile devices for everything from banking to automotive saf... » read more

Fan-Out And Packaging Challenges
By Mark LaPedus - 06 Oct, 2021 - Comments: 2

Semiconductor Engineering sat down to discuss various IC packaging technologies, wafer-level and panel-level approaches, and the need for new materials with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of globa... » read more

System-In-Package Thrives In The Shadows
By Mark LaPedus - 16 Sep, 2021 - Comments: 0

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

Challenges With Chiplets And Packaging
By Mark LaPedus - 15 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss IC packaging technology trends, chiplets, shortages and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Th... » read more

Tradeoffs Between Edge Vs. Cloud
By Brian Bailey - 09 Sep, 2021 - Comments: 0

Increasing amounts of processing are being done on the edge, but how the balance will change between what's computed in the cloud versus the edge remains unclear. The answer may depend as much on the value of data and other commercial reasons as on technical limitations. The pendulum has been swinging between doing all processing in the cloud to doing increasing amounts of processing at the ... » read more

Power/Performance Bits: Sept. 8
By Jesse Allen - 08 Sep, 2021 - Comments: 0

Backscatter radios for 5G Researchers at the Georgia Institute of Technology, Nokia Bell Labs, and Heriot-Watt University propose using backscatter radios to support high-throughput communication and 5G-speed Gb/sec data transfer using only a single transistor. “Our breakthrough is being able to communicate over 5G/millimeter-wave (mmWave) frequencies without actually having a full mmWave... » read more

Accelerating 5G Baseband With Adaptive SoCs: Part II
By Awanish Verma - 02 Sep, 2021 - Comments: 0

In my previous blog, we discussed 5G split architectures with focus on the widely adopted option 7-2 split. In this article, we will cover the implementation of the fronthaul and L1 Hi-PHY for 5G base stations. The 5G distributed unit (DU) can be implemented to process fronthaul data with O-RAN processing and partial offload for Hi-PHY processing which includes the LDPC encoder, LDPC decoder an... » read more

Grappling With Smart City Security Issues
By John Koon - 02 Sep, 2021 - Comments: 0

Security concerns are rising as cities seek to modernize services by connecting them to the internet and to each other, creating a widening attack surface that is a potential target for everything from disruption of services to ransomware demands. The goal of smart cities is to apply technology and intelligence to a variety of services to enable independent operation, real-time response, as ... » read more

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