tag: 5G

Advanced Packaging’s Next Wave
By Mark LaPedus - 20 May, 2021 - Comments: 0

Packaging houses are readying the next wave of advanced packages, enabling new system-level chip designs for a range of applications. These advanced packages involve a range of technologies, such as 2.5D/3D, chiplets, fan-out and system-in-package (SiP). Each of these, in turn, offers an array of options for assembling and integrating complex dies in an advanced package, providing chip custo... » read more

Potential For 5G In Daily Life
By Krishnan Shrinivasan - 20 May, 2021 - Comments: 0

The excitement around the rollout of 5G technology could not be more palpable. We see this next-generation technology in news headlines and commercials, with promises to usher in the next wave of internet capabilities, speeds, and frictionless internet access. Let’s look at what 5G is and how semiconductor advancements are driving this new technology. What is 5G? 5G technology can be su... » read more

Testing AiP Modules In High-Volume Production
By Jose Moreira - 11 May, 2021 - Comments: 0

Far-field and radiating near-field are two options for high-volume over-the-air (OTA) testing of antenna-in-package (AiP) modules with automated test equipment (ATE) [1]. In this article, we define an AiP device under test (DUT) and examine the measurement results from both methods. Creating an AiP evaluation vehicle Proper evaluation of an ATE OTA measurement setup requires an AiP module. Us... » read more

Security Concerns Rise For Connected Autos
By John Koon - 29 Apr, 2021 - Comments: 0

The auto industry is transforming itself toward a future in which the automobile increasingly will be connected using V2X and 5G. Driver assistance will improve, and ultimately cars will be guided by AI and machine learning. But all of this will be closely watched by hackers, looking for an opening and a potentially large and untraceable payout. The replacement of mechanical functionality wi... » read more

Technology Access Discriminates
By Brian Bailey - 22 Apr, 2021 - Comments: 3

I try not to get on a soap box in my blogs, but I hope you will allow me to express a concern that I see building and the projection of an unintended outcome. I am talking about who does and does not have access to technology. Over time, this divide can cause a further division based on geography, income level, or some other factor. The ramifications of it are not realized until it is too late.... » read more

Hyperconnectivity And The Path To 6G
By Frank Schirrmeister - 22 Apr, 2021 - Comments: 0

Some may view the recent uptick in the news about next-generation wireless networking, specifically 6G, with some healthy skepticism as 5G is “just rolling out.” But when looking at the timelines, it becomes clear why 6G is critical and is also excellent news for electronics, and by extension, the design of semiconductors and systems. The same key elements that transformed the data center t... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 16 Apr, 2021 - Comments: 0

Chipmakers TSMC has posted strong results and raised its capital spending budget to $30 billion, up from its prior guidance of $25 billion to $28 billion in 2021. “Its outlook indicates broad-based semiconductor demand continues to strengthen amid supply chain tightness,” said Weston Twigg, an analyst at KeyBanc, in a research note. “TSMC posted another quarter of strong demand for leadi... » read more

More Data Drives Focus On IC Energy Efficiency
By Ann Mutschler - 08 Apr, 2021 - Comments: 0

Computing workloads are becoming increasingly interdependent, raising the complexity level for chip architects as they work out exactly where that computing should be done and how to optimize it for shrinking energy margins. At a fundamental level, there is now more data to compute and more urgency in getting results. This situation has forced a rethinking of how much data should be moved, w... » read more

A Novel Complementary Architecture of One-time-programmable Memory and Its Applications as Physical Unclonable Function (PUF) and One-time Password
By Technical Paper Link - 31 Mar, 2021 - Comments: 0

Abstract "For the first time, we proposed a 2T complementary architecture of one-time-programmable memory (OTP) in a foundry logic CMOS chip. It was then used to realize the PUF (Physical unclonable function), and the combination with the AI technology to provide a one-time password capability. At first, an OTP was developed based on a novel 2T CMOS unit cell. The experimental results show t... » read more

Xilinx AI Engines And Their Applications
By Xilinx - 31 Mar, 2021 - Comments: 0

This white paper explores the architecture, applications, and benefits of using Xilinx's new AI Engine for compute intensive applications like 5G cellular and machine learning DNN/CNN. 5G requires between five to 10 times higher compute density when compared with prior generations; AI Engines have been optimized for DSP, meeting both the throughput and compute requirements to deliver the hig... » read more

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