tag: 5G

How 5G Affects Test
By Ed Sperling - 11 Nov, 2019 - Comments: 0

David Hall, head of semiconductor marketing at National Instruments, talks with Semiconductor Engineering about architectural changes to infrastructure due to the rollout of 5G and how the move from macrocells to small cells is changing test requirements.         Subscribe to Semiconductor Engineering's YouTube Channel here » read more

Revving Up For Edge Computing
By Ed Sperling - 07 Nov, 2019 - Comments: 1

The edge is beginning to take shape as a way of limiting the amount of data that needs to be pushed up to the cloud for processing, setting the stage for a massive shift in compute architectures and a race among chipmakers for a stake in a new and highly lucrative market. So far, it's not clear which architectures will win, or how and where data will be partitioned between what needs to be p... » read more

5G Needs Cohesive Pre- And Post-Silicon Verification
By Jean-Marie Brunet - 24 Oct, 2019 - Comments: 1

While 5G doesn’t start from a clean slate, it does make significant changes to the 4G architecture. These changes mean that the ecosystem from chips to operators is evolving, giving opportunities to more companies to engage in this growing market. Realignment in fronthaul, midhaul and backhaul In particular, the radio access network (RAN) has been redefined as Cloud RAN (sometimes called ... » read more

5G Verification Is Impossible Without Emulation
By Mentor, a Siemens Business - 23 Oct, 2019 - Comments: 0

Emulation, combined with a rich assortment of virtualized versions of the many protocols that 5G will require, is the only practical way of ensuring that the first round of silicon built will be the production version, able to handle all of the functions and configurations that it might be faced with and having the tight performance characteristics needed for successful integration into a 5G sy... » read more

Week in Review: IoT, Security, Autos
By Jeff Dorsch And Susan Rambo - 18 Oct, 2019 - Comments: 0

Products/Services The Networking for Autonomous Vehicles Alliance announces that Marvell Semiconductor is joining the NAV Alliance following its acquisition of Aquantia. Fourteen companies are in the industry organization, including Bosch, Continental, Nvidia, and Volkswagen. “The NAV Alliance is developing the platforms that will create the future of transportation and we believe that Multi... » read more

Week in Review – IoT, Security, Autos
By Jeff Dorsch - 11 Oct, 2019 - Comments: 0

Products/Services Arm TechCon got under way with a series of announcements. Arm is a founding member of the Autonomous Vehicle Computing Consortium, along with General Motors, Toyota Motor, DENSO, Continental, Bosch, NXP Semiconductors, and Nvidia. More information on the consortium is available here. “Imagine a world where vehicles are able to perceive their dynamically changing environment... » read more

Less Margin, More Respins, And New Markets
By Ed Sperling - 10 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx; Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

New Challenges In Testing 5G Devices
By Ed Sperling - 07 Oct, 2019 - Comments: 0

Alejandro Buritica, senior solutions marketing manager at National Instruments, talks about what will be needed for mass-market testing of 5G devices, how to focus signals to overcome signal attenuation, and how to make over-the-air testing viable where leads are not exposed. » read more

More Data, More Processing, More Chips
By Ed Sperling - 07 Oct, 2019 - Comments: 0

Simon Segars, CEO of Arm, sat down with Semiconductor Engineering to talk about the impact of heterogeneous computing and new packaging approaches on IP, the need for more security, and how 5G and the edge will impact compute architectures and the chip industry. SE: There are a whole bunch of new markets opening up. How does Arm plan to tackle those? Segars: Luckily for us, we can design ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Oct, 2019 - Comments: 0

Packaging and test In a major deal that has some implications in the OSAT supply chain, South Korea’s Nepes has taken over Deca Technologies’ wafer-level packaging manufacturing line in the Philippines. In addition, Nepes has also licensed Deca’s M-Series wafer-level packaging technology. This includes fan-in technology as well as wafer- and panel-level fan-out. It also includes an ad... » read more

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