Multi-Patterning EUV Vs. High-NA EUV


Foundries are finally in production with EUV lithography at 7nm, but chip customers must now decide whether to implement their next designs using EUV-based multiple patterning at 5nm/3nm or wait for a new single-patterning EUV system at 3nm and beyond. This scenario revolves around ASML’s current extreme ultraviolet (EUV) lithography tool (NXE:3400C) versus a completely new EUV system with... » read more

Designing In 4D


The chip design world is no longer flat or static, and increasingly it's no longer standardized. Until 16/14nm, most design engineers viewed the world in two dimensions. Circuits were laid out along x and y axes, and everything was packed in between those two borders. The biggest problems were that nothing printed as neatly as the blueprint suggested, and current leaked out of two-dimension... » read more

IP Management And Development At 5/3nm


The growing complexity of moving to new process nodes is making it much more difficult to create, manage and re-use IP. There are more rules, more data to manage, and more potential interactions as density increases, both in planar implementations and in advanced packaging. And the problems only get worse as designs move to 5nm and 3nm, and as more heterogeneous components such as accelerato... » read more

Making Random Variation Less Random


The economics for random variation are changing, particularly at advanced nodes and in complex packaging schemes. Random variation always will exist in semiconductor manufacturing processes, but much of what is called random has a traceable root cause. The reason it is classified as random is that it is expensive to track down all of the various quirks in a complex manufacturing process or i... » read more

Week In Review: Manufacturing, Test


Chipmakers The semiconductor capital spending race continues to escalate in the leading-edge logic space. Intel and Samsung have separately announced big capital spending plans in 2019. Intel’s latest CapEx budget is $15.5 billion in 2019, while Samsung’s CapEx is slated for $16.204 billion for the year, according to KeyBanc Capital Markets. Now, TSMC is raising the stakes. TSMC this... » read more

Mask Making Issues With EUV


Semiconductor Engineering sat down to discuss lithography and photomask trends with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Thomas Scheruebl, director of strategic business development and product strategy at Zeiss; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What fol... » read more

More Data, More Processing, More Chips


Simon Segars, CEO of Arm, sat down with Semiconductor Engineering to talk about the impact of heterogeneous computing and new packaging approaches on IP, the need for more security, and how 5G and the edge will impact compute architectures and the chip industry. SE: There are a whole bunch of new markets opening up. How does Arm plan to tackle those? Segars: Luckily for us, we can design ... » read more

Stacking Memory On Logic, Take Two


True 3D-ICs, where a memory die is stacked on top of a logic die using through-silicon vias, appear to be gaining momentum. There are a couple reasons why this is happening, and a handful of issues that need to be considered before even seriously considering this option. None of this is easy. On a scale of 1 to 10, this ranks somewhere around 9.99, in part because the EDA tools needed to rem... » read more

Another Brick Or Two In The Chip Design Wall


Physical challenges come and go in the semiconductor world. But increasingly, they also stick around, showing up in inconvenient places at the worst time. The chip industry has confronted and solved some massive challenges over the years. There was the 1 micron lithography wall, which was supposed to be impenetrable. That was followed by the 193nm litho challenge, which cost many billions of... » read more

Nvidia’s Top Technologists Discuss The Future Of GPUs


Semiconductor Engineering sat down to discuss the role of the GPU in artificial intelligence, autonomous and assisted driving, advanced packaging and heterogeneous architectures with Bill Dally, Nvidia’s chief scientist, and Jonah Alben, senior vice president of Nvidia’s GPU engineering, at IEEE’s Hot Chips 2019 conference. What follows are excerpts of that conversation. SE: There are ... » read more

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