tag: 6G

Hyperconnectivity And The Path To 6G
By Frank Schirrmeister - 22 Apr, 2021 - Comments: 0

Some may view the recent uptick in the news about next-generation wireless networking, specifically 6G, with some healthy skepticism as 5G is “just rolling out.” But when looking at the timelines, it becomes clear why 6G is critical and is also excellent news for electronics, and by extension, the design of semiconductors and systems. The same key elements that transformed the data center t... » read more

The Chip Industry’s Next-Gen Roadmap
By Mark LaPedus - 21 Jan, 2021 - Comments: 1

Todd Younkin, the new president and chief executive of the Semiconductor Research Corp. (SRC), sat down with Semiconductor Engineering to talk about engineering careers, R&D trends and what’s ahead for chip technologies over the next decade. What follows are excerpts of that conversation. SE: As a U.S.-based chip consortium, what is SRC's charter? Younkin: The Semiconductor Research... » read more

Power/Performance Bits: Aug. 25
By Jesse Allen - 25 Aug, 2020 - Comments: 0

AI architecture optimization Researchers at Rice University, Stanford University, University of California Santa Barbara, and Texas A&M University proposed two complementary methods for optimizing data-centric processing. The first, called TIMELY, is an architecture developed for “processing-in-memory” (PIM). A promising PIM platform is resistive random access memory, or ReRAM. Whil... » read more

What’s After 5G
By Bryon Moyer - 20 Jul, 2020 - Comments: 1

This year’s IEEE Symposia on VLSI Technology and Circuits (VLSI 2020) included a presentation by NTT Docomo that looked far into the future of cellular communications, setting the stage for a broad industry shift in communication. This is far from trivial. 5G only just recently entered the commercial world, and — especially with the higher millimeter-wave (mmWave) frequencies — it has ... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 08 May, 2020 - Comments: 0

Automotive Imagination Technologies and BAIC Capital have formed an automotive joint venture to create a new automotive fabless semiconductor company focused on China as a client. The JV will be headquartered in the Zhongguancun Integrated Circuit Design Park in Beijing, China, with Bravo Lee serving as CEO. The JV will license IP and software from Imagination to create automotive-grade SoCs. ... » read more

Manufacturing Bits: Jan. 7
By Mark LaPedus - 07 Jan, 2020 - Comments: 0

Beyond 5G chips At the recent IEEE International Electron Devices Meeting (IEDM), NTT and the Tokyo Institute of Technology presented a paper on a technology that could enable high-speed wireless devices beyond the 5G standard. Researchers have devised a 300GHz wireless transceiver (TRx) that supports a data rate of more than 100Gb/s. The device is based on a technology called indium phosph... » read more

Should We Even Be Talking About 6G?
By Sarah Yost - 12 Nov, 2019 - Comments: 0

Friends and coworkers have been sending me a lot of articles lately about 6G, with snappy headlines that seem to suggest that 5G is already a thing of the past. As a marketing manager working on cellular technology, they want to know what I think. On the one hand, I’m excited to see that the hype surrounding 5G is shining a spotlight on wireless communications research and that visionaries ar... » read more

Week in Review: IoT, Security, Autos
By Jeff Dorsch - 23 Aug, 2019 - Comments: 0

Products/Services Huawei Technologies is again delaying the public introduction of its Mate X foldable smartphone. It is unlikely the product will be marketed in the U.S., given the ongoing trade war. The official rollout now seems likely to come in November, in time for the holiday shopping season. Samsung Electronics has had its problems with foldable phones, yet those were due to manufactur... » read more

Power/Performance Bits: July 30
By Jesse Allen - 30 Jul, 2019 - Comments: 0

100GHz transceiver Engineers at the University of California Irvine built a new wireless transceiver that works above 100 gigahertz. The 4.4-millimeter-square silicon chip, called an "end-to-end transmitter-receiver," uses a digital-analog architecture that modulates the digital bits in the analog and radio-frequency domains to process digital signals quickly and energy-efficiently. "We cal... » read more

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