tag: AMD

Cheaper Packaging Options Ahead
By Ed Sperling - 05 Feb, 2018 - Comments: 0

Lower-cost packaging options and interconnects are either under development or just being commercialized, all of which could have a significant impact on the economics of advanced packaging. By far, the most cited reason why companies don't adopt advanced [getkc id="27" kc_name="packaging"] is cost. Currently, silicon [getkc id="204" kc_name="interposers"] add about $30 to the price of a med... » read more

The Week In Review: Design
By Jesse Allen - 26 Jan, 2018 - Comments: 0

Security Addressing the Meltdown and Spectre speculative execution vulnerabilities has not gone smoothly. Intel's firmware update caused unexpected behavior and a higher than expected number of reboots for its Haswell and Broadwell chips, leading the company to recommend users stop patching until an updated version of the patch is available. Microsoft's attempts to fix the issue left some W... » read more

Pattern-Based Analytics To Estimate And Track Yield Risk Of Designs Down To 7nm
By Cadence - 24 Jan, 2018 - Comments: 0

Topological pattern-based methods for analyzing IC physical design complexity and scoring resulting patterns to identify risky patterns have emerged as powerful tools for identifying important trends and comparing different designs. In this paper, previous work is extended to include analysis of layouts designed for the 7nm technology generation. A comparison of pattern complexity trends with r... » read more

The Week In Review: Design
By Jesse Allen - 05 Jan, 2018 - Comments: 1

Security Security researchers identified a major exploit of the "speculative execution" technique used to optimize performance in modern processors. The flaws allow an attacker to read sensitive information in the system's memory such as passwords, encryption keys, or sensitive information open in applications, according to Google's Jann Horn. Multiple researchers discovered the issues indepen... » read more

Blockchain: Hype, Reality, Opportunities
By Susan Breidenbach - 04 Jan, 2018 - Comments: 4

Blockchain buzz has reached deafening levels, and its proponents say we haven’t heard anything yet. The blockchain-enabled transformations they describe make the Internet revolution look almost trivial. Critics argue that too many people drank the blockchain Kool-Aid. Outside the cryptocurrency arena, they say that blockchain amounts to little more than some really slick slideware. The ... » read more

Five Trends In IC Packaging
By Mark LaPedus - 16 Nov, 2017 - Comments: 0

At one time, chip packaging was an afterthought. Chipmakers were more worried about IC design. Packaging was considered a mere commodity, which was simply used to house the design. More recently, though, chip packaging has become a hot topic. The IC design is still important, but packaging is a key part of the solution. In fact, the industry can go down two paths. The traditional way is t... » read more

The Week In Review: Design
By Jesse Allen - 10 Nov, 2017 - Comments: 0

IP Cryptographic flaws have been discovered in the IEEE P1735 standard for encrypting IP and managing access rights. A team from the University of Florida found "a surprising number of cryptographic mistakes in the standard. In the most egregious cases, these mistakes enable attack vectors that allow us to recover the entire underlying plaintext IP." The researchers warn that an adversary coul... » read more

Memory Test Challenges, Opportunities
By Jeff Dorsch - 18 Oct, 2017 - Comments: 0

The semiconductor capital equipment market is on fire, and the memory chip test equipment sector is no different. But it is getting much more difficult on the memory side. Memory test vendors are contending with next-generation devices, such as 3D NAND flash memories, HBM2 chips, low-power double-data-rate DRAMs, graphics DRAMs, phase-change memories, magnetoresistive RAMs, and resistive RAM... » read more

Power Modeling and Analysis
By Brian Bailey - 20 Sep, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss power modeling and analysis with [getperson id="11489" p_name="Drew Wingard"], chief technology officer at [getentity id="22605" e_name="Sonics"]; [getperson id="11763" comment="Tobias Bjerregaard"], chief executive officer for [getentity id="22908" e_name="Teklatech"]; Vic Kulkarni, vice president and chief strategy officer at [getentity id="22021"... » read more

Frenzy At 10/7nm
By Ann Mutschler - 14 Sep, 2017 - Comments: 1

The number of chipmakers rushing to 10/7nm is rising, despite a slowdown in Moore's Law scaling and the increased difficulty and cost of developing chips at the most advanced nodes. How long this trend continues remains to be seen. It's likely that 7/5nm will require new manufacturing equipment, tools, materials and transistor structures. Beyond that, there is no industry-accepted roadmap, m... » read more

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