Week in Review: IoT, Security, Autos

By Jeff Dorsch - 16 Aug, 2019 - Comments: 0

Products/Services Arm released a survey of 650 industry representatives about eSIM and iSIM technology. Ninety percent of the respondents were aware of eSIM, while 43% were unaware of iSIM. Vincent Korstanje, vice president and general manager, Emerging Businesses at Arm, cites the leading three obstacles to large commercial deployments: Resistance from traditional stakeholders (69% of respond... » read more

Week In Review: Design, Low Power

By Jesse Allen - 16 Aug, 2019 - Comments: 0

Everspin and Seagate inked a patent cross-licensing agreement, including the assignment and licensing of MRAM patents from Seagate to Everspin as well as licensing of specific Tunneling Magnetoresistance (TMR) patents from Everspin to Seagate, which will be used in HDD read/write head technology. Subaru utilized ANSYS' SCADE suite for critical control systems to design and validate embedded ... » read more

Power Modeling Standard Released

By Brian Bailey - 14 Aug, 2019 - Comments: 0

Power is becoming a more important aspect of semiconductor design, but without an industry standard for power models, adoption is likely to be slow and fragmented. That is why Si2 and the IEEE decided to do something about it. Back in 2014, the IEEE expanded its interest in power standards with the creation of two new groups IEEE P2415 - Standard for Unified Hardware Abstraction and Layer fo... » read more

Blog Review: Aug. 14

By Jesse Allen - 14 Aug, 2019 - Comments: 0

Cadence's Paul McLellan digs into Mary Meeker's analysis of Internet trends, from growth of the Inernet as a whole to cyber attacks, online finance, and the gig economy. Synopsys' Taylor Armerding warns that the financial services industry is aware of cybersecurity threats, but isn't doing enough to protect its networks and data. Mentor's Colin Walls considers a few cases where writing in... » read more

Powering The Edge: Driving Optimal Performance With the Arm ML Processor

By Arm - 07 Aug, 2019 - Comments: 0

On-device machine learning (ML) processing is already happening in more than 4 billion smart phones. As the adoption of connected devices continues to grow exponentially, the resulting data explosion means cloud processing could soon become an expensive and high-latency luxury. The Arm ML processor is defining the future of ML inference at the edge, allowing smart devices to make independent... » read more

Blog Review: Aug. 7

By Jesse Allen - 07 Aug, 2019 - Comments: 0

Synopsys' Taylor Armerding considers whether ransomware attacks on cities aren't only about money but if there are political motivations for intentionally sowing chaos and dysfunction. Cadence's Paul McLellan takes a look at the different way radio spectrum for 5G is being allocated in the U.S., which recently auctioned 24GHz bands for mmWave, and the rest of the world, which has focused on ... » read more

More Semiconductor Data Moving To Cloud

By Ed Sperling - 06 Aug, 2019 - Comments: 0

The cloud is booming. After years of steady growth it has begun to spike, creating new options for design, test, analytics and AI, all of which have an impact on every segment of the semiconductor industry. The initial idea behind the cloud is that it would supplement processing done on premises, adding extra processing power wherever necessary, such as in the verification and debug stages o... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 02 Aug, 2019 - Comments: 0

Products/Services Rambus agreed to acquire Hillsboro, Ore.-based Northwest Logic, a purveyor of memory, PCIe, and MIPI digital controllers. The transaction is expected to close in the current quarter. Financial terms weren’t disclosed; Rambus said in a statement, “Although this transaction will not materially impact 2019 results due to the expected timing of close and acquisition accountin... » read more

Where Should Auto Sensor Data Be Processed?

By Ann Mutschler - 01 Aug, 2019 - Comments: 0

Fully autonomous vehicles are coming, but not as quickly as the initial hype would suggest because there is a long list of technological issues that still need to be resolved. One of the basic problems that still needs to be solved is how to process the tremendous amount of data coming from the variety of sensors in the vehicle, including cameras, radar, LiDAR and sonar. That data is the dig... » read more

Blog Review: July 31

By Jesse Allen - 31 Jul, 2019 - Comments: 0

Cadence's Meera Collier checks out a study that uses AI and natural language processing techniques to infer new discoveries in materials science from published academic literature and considers how it could be used in the future. Synopsys' Taylor Armerding considers whether the NIST Secure Software Development Framework, the latest standard aimed at improving software security, can succeed. ... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?