Blog Review: April 19

By Jesse Allen - 19 Apr, 2023 - Comments: 0

Synopsys' Soren Smidstrup and Kerim Genc explore how materials modeling helps battery designers explore the wide playing field for new battery materials and optimize performance by co-designing the structure and chemistry of new batteries, ultimately shortening development time and cost. Siemens' Stephen Chavez finds that enabling multiple engineers to work simultaneously within the same PCB... » read more

Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 14 Apr, 2023 - Comments: 0

U.S. Senate Majority Leader Chuck Schumer said he launched an effort to establish rules on artificial intelligence to address national security and education concerns, Reuters reported. "Time is of the essence to get ahead of this powerful new technology to prevent potentially wide-ranging damage to society and national security and instead put it to positive use by advancing strong, bipartisan... » read more

Week In Review: Design, Low Power

By Jesse Allen - 14 Apr, 2023 - Comments: 0

Arm and Intel Foundry Services inked a multi-generation agreement to enable chip designers to build Arm-based SoCs on the Intel 18A process. The initial focus is mobile SoC designs, but the deal allows for potential expansion into automotive, IoT, data center, aerospace, and government applications. IFS and Arm will undertake design technology co-optimization (DTCO) to optimize chip design and ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 14 Apr, 2023 - Comments: 0

Public USB phone charging stations are now another vector that bad actors can use to plant malware and steal data on devices — known as "juice jacking," according to the United States’ Federal Communications Commission (FCC). The FCC is encouraging people to stay away from these public charging stations, found in airports and hotels, because of bad actors can install malware on the charging... » read more

Introducing Device Virtualization Principles For Real-Time Systems

By Alexandre Romana - 13 Apr, 2023 - Comments: 0

The rising market share of electric vehicles and the reduction in combustion engines required in the future is transforming the automotive industry. One could think this would lead to a simplification in vehicle design, but with driver assistance technologies becoming a key differentiator, they are in fact becoming real "data centers on wheels." Furthermore, car drivers are used to a consumer-b... » read more

RISC-V Driving New Verification Concepts

By Brian Bailey - 12 Apr, 2023 - Comments: 0

Semiconductor Engineering sat down to discuss gaps in tools and why new methodologies are needed for RISC-V processors, with Pete Hardee, group director for product management at Cadence; Mike Eftimakis, vice president for strategy and ecosystem at Codasip; Simon Davidmann, founder and CEO of Imperas Software; Sven Beyer, program manager for processor verification at Siemens EDA; Kiran Vittal, ... » read more

Blog Review: April 12

By Jesse Allen - 12 Apr, 2023 - Comments: 0

Cadence's Ericles Sousa describes the five critical features of automotive SoC architectures that are essential for developing the next generation of passenger vehicles. In a podcast, Siemens' Steph Chavez chats with Gerry Partida of Summit Interconnect about the difficulties in collaboration between PCB designers and manufacturers, along with best practices that designers should follow to r... » read more

Why Data-Over-Sound Is An Integral Part Of Any IoT Engineer’s Toolbox

By Arm - 12 Apr, 2023 - Comments: 0

Data-over-sound technology such as Chirp presents a compelling solution for many device-to-device connectivity applications, particularly for use cases that require frictionless, low cost connectivity with nearby devices. Download this white paper to: Understand the fundamental concepts and benefits of data-over-sound connectivity Explore the key application areas within the Internet... » read more

Growing Challenges For Increasingly Connected Vehicles

By John Koon - 06 Apr, 2023 - Comments: 0

Automobiles will become increasingly connected over the next decade, but that connectivity will come at a price in terms of dollars, security, and constantly changing technology. Connectivity involves all parts of a vehicle. It includes everything from autonomous driving to in-cabin monitoring and connected infotainment. And it encompasses external sensors, IoT, V2X, over-the-air communicati... » read more

What’s Required To Secure Chips

By Ed Sperling - 06 Apr, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about how to verify that a semiconductor design will be secure, with Mike Borza, Synopsys scientist; John Hallman, product manager for trust and security at Siemens EDA; Pete Hardee, group director for product management at Cadence; Paul Karazuba, vice president of marketing at Expedera; and Dave Kelf, CEO of Breker Verification. ... » read more

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Knowledge Centers
Entities, people and technologies explored

Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Chip Industry Week In Review

Softbank's acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.

by The SE Staff

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

tag: ARM