Blog Review: July 27


Siemens' Keith Felton expects a greater emphasis on several areas of semiconductor package design next year, including accelerated growth of heterogeneous integration, multiple die, and chiplet SiPs, emergence and adoption of organic-based interposers, and early detection of thermal and electromechanical issues. Cadence's Paul McLellan visits Imec to find out about getting the heat out of 3D... » read more

Near-Threshold Computing Gets A Boost


Near-threshold computing has long been used for power-sensitive devices, but some surprising, unrelated advances are making it much easier to deploy. While near-threshold logic has been an essential technique for applications with the lowest power consumption, it always has been difficult to use. That is changing, and while it is unlikely to become a mainstream technique, it is certainly bec... » read more

Week In Review: Auto, Security, Pervasive Computing


Security Flex Logix Technologies is partnering with Intrinsic ID to secure and protect any device using its eFPGA, so the device can’t be modified maliciously, through physical attacks or remote hacking. Flex Logix’s EFLX ePFGA will have Intrinsic ID’s SRAM physical unclonable function (PUF), a military-grade security IP that gives a device a unique silicon ID. The ID secures confidentia... » read more

Telecare Challenges: Secure, Reliable, Lower Power


The adoption of telecare using a variety of connected digital devices is opening the door to much more rapid response to medical emergencies, as well as more consistent monitoring, but it also is adding new challenges involving connectivity, security, and power consumption. Telecare has been on the horizon for the better part of two decades, but it really began ramping with improvements in s... » read more

Blog Review: July 20


Synopsys' Ron Lowman examines the various neural networks used in camera applications, the balancing act between camera lens choice and neural networks implemented, and how IP and embedded vision processors help optimize the designs. Siemens' Katie Tormala considers the importance of acoustic performance in consumer electronics and why it's important to understand the relationships between t... » read more

Heterogenous Integration Creating New IP Opportunities


The design IP market has long been known for constant change and evolution, but the industry trend toward heterogenous integration and chiplets is creating some new challenges and opportunities. Companies wanting to stake out a claim in this area have to be nimble, because there will be many potential standards introduced, and they are likely to change quickly as the industry explores what is r... » read more

Building The Metaverse, Part One: The Vision


The longer-term vision of the metaverse is a universe where a massive computer-generated virtual world – or worlds – will be deeply intertwined with the physical world. This will enable humans and things to interact, transact, and collaborate in parallel or in superposition in ways that will mesh real-world activity and simulation in various and increasing indistinguishable ways. The met... » read more

Using AI To Speed Up Edge Computing


AI is being designed into a growing number of chips and systems at the edge, where it is being used to speed up the processing of massive amounts of data, and to reduce power by partitioning and prioritization. That, in turn, allows systems to act upon that data more rapidly. Processing data at the edge rather than in the cloud provides a number of well-documented benefits. Because the physi... » read more

Introduction To The Arm Cortex-M55 Processor


This white paper covers the technical details, including pipeline, floating-point support and features of Arm Cortex-M55 processor. The Arm Cortex-M55 processor is Arm’s most AI-capable Cortex-M processor and the first to feature Arm Helium vector processing technology, bringing enhanced, energy efficient signal processing and machine learning (ML) performance. Click here to read more. » read more

Week In Review: Design, Low Power


Tools & IP Cadence will acquire Future Facilities, a provider of electronics cooling analysis and energy performance optimization solutions for data center design and operations using physics-based 3D digital twins. Future Facilities’ product portfolio includes an electronics thermal solution, as well as computational fluid dynamics (CFD) electronics cooling simulation technology that op... » read more

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