tag: DRAM

Reflections On 2015
By Brian Bailey - 10 Dec, 2015 - Comments: 0

It is easy to make predictions, but few people can make them with any degree of accuracy. Most of the time, those predictions are forgotten by the end of the year and there is no one to do a tally of who holds more credibility for next year. Not so with Semiconductor Engineering. We like to hold people's feet to the fire, but while the "Pants-On-Fire" meter may be applicable to politicians, we ... » read more

Innovation Matters
By Zining Wu - 09 Dec, 2015 - Comments: 0

Innovation is not something that just happens. It requires a culture that rewards innovation, and the only way to make that happen is with buy-in at every level. What's needed is a climate for building, inventing and designing ICs and systems that push technology boundaries and help move the industry forward. This is a key ingredient for innovation that has been used across the globe to brin... » read more

On-Chip Networks Optimize Shared Memory For Multicore SoCs
By Sonics - 23 Nov, 2015 - Comments: 0

Performance of multicore SoCs is often dominated by external DRAM access, particularly in digital consumer devices running high quality video and graphics applications. Increasing core counts and newer DRAMs make the problems much more difficult. This article covers optimization of the on-chip network and memory system to achieve the required system throughput. For more information, click here. » read more

Overcoming The Design Bottleneck
By Brian Bailey - 12 Nov, 2015 - Comments: 0

SoCs control most advanced electronics these days and functionality, quality, power and security are a combination of both hardware and software. All throughout the development of today's complex systems, the memory hierarchy has remained the same—preserving the notion of a continuous computing paradigm. Today, that decision is leading to performance and power issues. There are several rea... » read more

High Speed Memory Interface Chipsets Let Server Performance Fly
By Rambus - 11 Nov, 2015 - Comments: 0

The demands on server performance continue to increase at a tremendous pace. New requirements from large in-memory databases that are powering today’s cloud services and advanced analytics tools are arriving just as the impact of Moore’s Law is starting to slow. This is setting up a classic performance challenge that requires rethinking some of the core elements of today’s server archit... » read more

China’s Fab Tool Biz Heats Up
By Mark LaPedus - 28 Oct, 2015 - Comments: 0

For years, China has been a steady growth market for suppliers of semiconductor equipment. Internally, though, the country is comprised of trailing-edge fabs and IC-assembly houses, which means equipment vendors sell relatively mature tools and compete on price. That’s about to change, however. Today, the IC equipment business is heating up in China as the nation begins to upgrade and pour... » read more

What China Is Planning
By Mark LaPedus - 21 Oct, 2015 - Comments: 1

Over the years, China has unveiled several initiatives to advance its domestic semiconductor industry. China has made some progress at each turn, although every plan has fallen short of expectations. But now, the nation is embarking on several new and bold initiatives that could alter the IC landscape. China’s new initiatives address at least three key challenges for its IC industry: 1. C... » read more

Is The 2.5D Supply Chain Ready?
By Ed Sperling - 28 Sep, 2015 - Comments: 0

A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

Inside The MRAM
By Mark LaPedus - 17 Sep, 2015 - Comments: 0

Today, the industry is shipping various next-generation nonvolatile memory types, such as 3D NAND, MRAM and ReRAM. In fact, MRAM has been shipping for some time. To get a handle on MRAM, Semiconductor Engineering sat down to discuss the technology with Phillip LoPresti, president and chief executive of Everspin, a supplier of MRAMs. What follows are excerpts of that conversation. SE: Where ... » read more

ALD Market Heats Up
By Mark LaPedus - 17 Sep, 2015 - Comments: 1

Amid the shift to 3D NAND, finFETs and other device architectures, the atomic layer deposition (ALD) market is heating up on several fronts. Applied Materials, for example, recently moved to shakeup the landscape by rolling out a new, high-throughput ALD tool. Generally, [getkc id="250" kc_name="ALD"] is a process that deposits materials layer-by-layer at the atomic level, enabling thin and ... » read more

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