tag: DRAM

Executive Insight: Charlie Cheng
By Ed Sperling - 14 Sep, 2015 - Comments: 1

Charlie Cheng, CEO of Kilopass, sat down with Semiconductor Engineering to talk about issues with current memory types and why the market is ready for disruptive approaches to reduce power and cost. SE: What's changing in the memory space? Cheng: Memory is a very important building block. It's a foundation and a commodity for a chip and for the system, but if you look at the big picture, ... » read more

Which Memory Type Should You Use?
By Loren Shalinsky - 10 Sep, 2015 - Comments: 1

I continue to get besieged by statements in which memory “latency” and “bandwidth” get misused. As I mentioned in my last blog, latency is defined as how long the CPU needs to wait before the first data is available, while bandwidth is how fast additional data can be “streamed” after the first data point has arrived. Bandwidth becomes a bigger factor in performance when data is stor... » read more

Inside The 5G Smartphone
By Mark LaPedus - 20 Aug, 2015 - Comments: 3

Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. In fact, major carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Intel, Samsung and Qualcom... » read more

Tech Talk: DDR4
By Ed Sperling - 17 Aug, 2015 - Comments: 1

Rambus' Ely Tsern digs into the challenges in integrating DDR4 compared with DDR3 and why it will get even more difficult over the next few iterations. [youtube vid=2M6vFweaZ-M] » read more

2.5D Creeps Into SoC Designs
By Ed Sperling - 13 Aug, 2015 - Comments: 0

A decade ago top chipmakers predicted that the next frontier for SoC architectures would be the z axis, adding a third dimension to improve throughput and performance, reduce congestion around memories, and reduce the amount of energy needed to drive signals. The obvious market for this was applications processors for mobile devices, and the first companies to jump on the stacked die bandwag... » read more

It’s a Materials World, With Positive Forecast
By SEMI - 23 Jul, 2015 - Comments: 0

By Michael Fury What’s the latest in materials forecasts for ALD/CVD precursors, CMP consumables, electronic gases, silicon wafers and sputtering targets? Techcet gives us an update. Metal Gate and Electrode Precursors to Double in Five Years Use of front-end Ta and W metal gate and Hf gate dielectric precursors will grow over 2.5x by 2020, according to a new report from Techcet, “20... » read more

Moore Memory Problems
By Brian Bailey - 09 Jul, 2015 - Comments: 0

The six-transistor static memory cell (SRAM) has been the mainstay of on-chip memory for several decades and has stood the test of time. Today, many advanced SoCs have 50% of the chip area covered with these memories and so they are critical to continued scaling. “The SRAM being used in modern systems is similar to the SRAM they were using in the 1970s and 1980s,” says Duncan Bremner, ch... » read more

Don’t Let The Headlines Trick You
By Loren Shalinsky - 09 Jul, 2015 - Comments: 0

This is the time of year when reports get issued summarizing the sales results of the server market in the first quarter. As a way of grabbing attention, many of the headlines will mention that the results of the first quarter are below those of the fourth quarter, bringing to mind all sorts of doomsday scenarios. Don’t be fooled. In many industries, sales exhibit a large seasonal compo... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 Jun, 2015 - Comments: 0

Since the global economic recession of 2008-2009, the IC industry has pared down older fab capacity. From 2009-2014, semiconductor manufacturers have closed or repurposed 83 wafer fabs, including a few 300mm plants, according to IC Insights. Are 3D DRAMs finally here? SK Hynix is shipping mass production volumes of its first-generation High Bandwidth Memory (HBM1). Samsung is also backing it... » read more

10nm Fab Watch
By Mark LaPedus - 21 May, 2015 - Comments: 1

When will the 10nm logic node happen? Analysts believe that foundry vendors will move into 10nm finFET volume production around 2017. Still others say the 10nm finFET ramp could take place anywhere from 2018 to 2020. The predictions are all over the map. One way to predict the timing, progress and demand for 10nm is simple: Follow the fabs. In fact, Intel, Samsung, TSMC and GlobalFound... » read more

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