The Future Of Moore’s Law

By Ed Sperling - 22 Jul, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss the future of Moore's Law with Jan Rabaey, Donald O. Pederson distinguished professor at [getentity id="22165" comment="UC Berkeley"]; Lucio Lanza, managing director of Lanza techVentures; Subramani Kengeri, vice president of advanced technology architecture at GlobalFoundries; Charlie Cheng, CEO of [getentity id="22135" e_name="Kilopass Technology"... » read more

Tale Of Two HLS Viewpoints

By Brian Bailey - 09 Jul, 2015 - Comments: 0

The Design Automation Conference attracts several co-located conferences, symposiums and other such gathering of people, often on more specialized topics than would appeal to the general DAC attendees. Some of them are more research-focused, but one conference is somewhat strange in that it is about a subject that has transitioned to commercial tool development and yet still remains an active a... » read more

IP Integration Challenges Increase

By Ed Sperling - 08 Jul, 2015 - Comments: 0

Semiconductor Engineering sat down with Chris Rowen, CTO of [getentity id="22032" e_name="Cadence"]'s IP group; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Navraj Nandra, senior director of marketing for DesignWare analog and mixed-signal IP at [getentity ... » read more

EDA Sales Strong Again

By Ed Sperling - 07 Jul, 2015 - Comments: 0

EDA and IP sales were robust again in Q1, up 7.5% to $1.877 billion compared with $1.746 billion in the same period in 2014, according to the EDA Consortium. On the upside, IP revenue rose 19.3% to $618.1 million; services revenue increased 6.8% to $104.4 million; and PCB and multi-chip module revenue increased 1.1% to $161.5 million. On the downside, CAE—the largest single category—... » read more

Executive Insight: Wally Rhines

By Ed Sperling - 01 Jul, 2015 - Comments: 0

Wally Rhines, chairman and CEO of Mentor Graphics, sat down with Semiconductor Engineering to talk about what's changing across a wide swath of the industry, where the new opportunities will be, when security will become a real opportunity for EDA, and why Moore's Law will die but progress will continue forever. SE: Looking back over the past year, what's changed and where are the possible r... » read more

EDA’s Clouded Future

By Brian Bailey - 25 Jun, 2015 - Comments: 0

There was a time, not that long ago, when chip design and EDA tools consumed some of the largest data centers with tens of thousands of machines and single datasets that consumed more than a hard disk could hold. The existing IT capabilities of the times were stretched to their limits. But while design sizes grew, other aspects of the flow did not develop as fast. “This has been driven by ... » read more

What Is A System Now?

By Ann Mutschler - 25 Jun, 2015 - Comments: 0

Defining a system used to be relatively straightforward. But as systems move onto chips, and as those chips increasingly are connected with applications and security spanning multiple devices, the definition is changing. This increases the complexity of the design process itself, and it raises questions about how chips and software will be designed and defined in the age of the [getkc id="76... » read more

Tear Down The Wall Between Front-End And Back-End Teams

By Kurt Shuler - 25 Jun, 2015 - Comments: 1

As complexity of system-on-chip devices increases, it's becoming imperative for design teams and organizations to re-examine how they work with one another in order to improve productivity. One giant step in this direction is to bridge the divide between the front-end design process and the physical back-end design process. We often refer to this as a figurative “wall,” but there is real... » read more

Big Data, Big Opportunities

By Jens Andersen - 25 Jun, 2015 - Comments: 0

For the last two decades I have spent a lot of my time managing operations and sales for several EDA startups, most of which were acquired. The focus of many of these companies was to provide solutions to optimize complex designs. We worked to enhance many of the top 25 semiconductor companies’ physical implementation flows using cutting edge technologies and methodologies to improve power, p... » read more

Foundries Expand Planar Efforts

By Mark LaPedus - 18 Jun, 2015 - Comments: 0

Competition is heating up in the leading-edge foundry business, as vendors begin to ramp up their new 16nm/14nm finFET processes. But that’s not the only action in the foundry arena. They are also expanding their efforts in the leading-edge planar market by rolling out new 28nm and 22nm processes. On one front, TSMC is offering new 28nm variants, based on bulk CMOS technology. And on an... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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