tag: IBM

Rethinking SSDs In Data Centers
By Gale Morrison - 03 Aug, 2017 - Comments: 0

Semiconductors that control how data gets on and off solid-state drives (SSDs) inside of data centers are having a moment in the sun. This surge in interest involves much more than just the SSD device. It leverages an entire ecosystem, starting with system architects and design engineers, who must figure out the best paths for data flow on- and off-chip and through a system. It also includes... » read more

The Week In Review: IoT
By Jeff Dorsch - 28 Jul, 2017 - Comments: 0

Finance August Home received $25 million in Series C funding, bringing its total funding to $75 million. Existing investors Bessemer Venture Partners, Comcast Ventures, Maveron, and Qualcomm Ventures were joined by AGL, Liberty Mutual, and SPDG. The Internet of Things startup will use the money to expand operations and to extend its offerings in home access products and services. Prospera, ... » read more

The Week In Review: IoT
By Jeff Dorsch - 21 Jul, 2017 - Comments: 0

Finance Particle, the provider of a full-stack Internet of Things device platform for enterprises, has raised $20 million in Series B funding, bringing its total venture funding to $30 million. Spark Capital led the new round, with participation by Qualcomm Ventures and existing investors in the IoT startup. Machina Research estimates cellular IoT connections will increase from 334 million in ... » read more

Blog Review: July 12
By Jesse Allen - 12 Jul, 2017 - Comments: 0

Mentor's Puneet Sinha points to five big engineering stumbling blocks in building commercially-viable autonomous vehicles. Synopsys' Anders Nordstrom checks out some exotic applications of formal verification. Cadence's Paul McLellan listens in on a talk by Cadence's Michelle (Xuehong) Mao on how the company's deep neural network, CactusNet, works for optimizing network architecture. S... » read more

Shrink Or Package?
By Ed Sperling - 19 Jun, 2017 - Comments: 0

Advanced packaging is rapidly becoming a mainstream option for chipmakers as the cost of integrating heterogeneous components on a single die continues to rise. Despite several years of buzz around this shift, the reality is that it has taken more than a half-century to materialize. Advanced [getkc id="27" kc_name="packaging"] began with IBM flip chips in the 1960s, and it got another boost ... » read more

Architecture First, Node Second
By Ed Sperling - 15 Jun, 2017 - Comments: 0

What a difference a node makes. A couple of rather important changes have occurred in the move from 16/14 to 10/7nm (aside from more confusing naming conventions). First, companies that require more transistors—processor companies such as [getentity id="22846" e_name="Intel"], AMD, [getentity id="22306" comment="IBM"] and [getentity id="22676" e_name="Qualcomm"]—have come to grips with t... » read more

New BEOL/MOL Breakthroughs?
By Mark LaPedus - 15 Jun, 2017 - Comments: 1

Chipmakers are moving ahead with transistor scaling at advanced nodes, but it's becoming more difficult. The industry is struggling to maintain the same timeline for contacts and interconnects, which represent a larger portion of the cost and unwanted resistance in chips at the most advanced nodes. A leading-edge chip consists of three parts—the transistor, contacts and interconnects. The ... » read more

Modeling On-Chip Variation At 10/7nm
By Ann Mutschler - 14 Jun, 2017 - Comments: 1

Simulation, a workhorse tool for semiconductor design, is running out of steam at 10/7nm. It is falling behind on chips with huge gate counts and an enormous number of possible interactions between all the different functions that are being crammed onto a die. At simulation's root is some form of SPICE, which has served as its underpinnings ever since SPICE was first published 44 years ago. ... » read more

2.5D, ASICs Extend to 7nm
By Mark LaPedus - 13 Jun, 2017 - Comments: 2

The leading-edge foundry market is heating up. For example, GlobalFoundries, Intel, Samsung and TSMC have recently announced their new and respective processes. The new processes from vendors range anywhere from 10nm to 4nm, although the current battle is taking place at 10nm and/or 7nm. In fact, one vendor, GlobalFoundries, this week will describe more details about its previously-announced... » read more

System Bits: June 6
By Ann Mutschler - 06 Jun, 2017 - Comments: 0

Silicon nanosheet-based builds 5nm transistor To enable the manufacturing of 5nm chips, IBM, GLOBALFOUNDRIES, Samsung, and equipment suppliers have developed what they say is an industry-first process to build 5nm silicon nanosheet transistors. This development comes less than two years since developing a 7nm test node chip with 20 billion transistors. Now, they’ve paved the way for 30 billi... » read more

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