tag: IBM

What Is ‘Digital’?
By Brian Bailey - 27 Aug, 2015 - Comments: 1

I saw a LinkedIn article with this title a couple of weeks ago and was curious. Do we not know what digital is and do we need to question it? When I read the first line I was very surprised and somewhat confused. Ved Sen, the author said that, “Despite working in the digital space for years, now I was quite stumped a few weeks ago when I was asked to define it.” Why would digital be so d... » read more

2.5D Creeps Into SoC Designs
By Ed Sperling - 13 Aug, 2015 - Comments: 0

A decade ago top chipmakers predicted that the next frontier for SoC architectures would be the z axis, adding a third dimension to improve throughput and performance, reduce congestion around memories, and reduce the amount of energy needed to drive signals. The obvious market for this was applications processors for mobile devices, and the first companies to jump on the stacked die bandwag... » read more

Making Hardware Design More Agile
By Ed Sperling - 12 Aug, 2015 - Comments: 1

Semiconductor engineering sat down to whether changes are needed in hardware design methodology, with Philip Gutierrez, ASIC/FPGA design manager in [getentity id="22306" comment="IBM"]'s FlashSystems Storage Group; Dennis Brophy, director of strategic business development at [getentity id="22017" e_name="Mentor Graphics"]; Frank Schirrmeister, group director for product marketing of the System ... » read more

Multiple Lithography Options Still Remain in Play
By Paula Doe - 03 Aug, 2015 - Comments: 1

The throughput and uptime of EUV, and the overlay accuracy of 193nm immersion lithography, continue to steadily improve, though neither is yet ready for 10nm production, according to speakers at SEMICON West. Mike Lercel, ASML director, Product Marketing, reported several EUV tool sites achieved 70 percent uptime for more than a week, and one customer site had done so for more than four ... » read more

The Next Big Things
By Ed Sperling - 30 Jul, 2015 - Comments: 0

Progress in electronics has always been about combining more functions into devices and making access to information more convenient. This is what drove the PC revolution in the 1980s, when centralized data was made available on desktops, and it's what drove the notebook PC revolution in the 1990s as computers became untethered from the desktop, as long as you could find an Ethernet connecti... » read more

Securing EDA In The Cloud
By Brian Bailey - 30 Jul, 2015 - Comments: 1

In the first part of this article, EDA’s Clouded Future, the types of application suitable for cloud-based solutions were examined and the cost benefits that could arise for both EDA suppliers and consumers. Security has stood in the way of widespread adoption, but it is a little more complex than just being concerned about a theft of sensitive design data. Security involves data protect f... » read more

Making Hardware Design More Agile
By Ed Sperling - 30 Jul, 2015 - Comments: 0

Semiconductor engineering sat down to whether changes are needed in hardware design methodology, with Philip Gutierrez, ASIC/FPGA design manager in [getentity id="22306" comment="IBM"]'s FlashSystems Storage Group; Dennis Brophy, director of strategic business development at [getentity id="22017" e_name="Mentor Graphics"]; Frank Schirrmeister, group director for product marketing of the System ... » read more

Consolidation Creates Confusion
By Mike Gianfagna - 30 Jul, 2015 - Comments: 0

Consolidation in any industry is a sign of maturation. Diverse business models converge to the ones that really work. Supply and demand find equilibrium with a right-sized supply base. And generally, the fittest survive. The semiconductor industry is somewhere around a half-century old, so consolidation in this industry is to be expected, and we have certainly seen some consolidation of late. ... » read more

Fab Issues At 7nm And 5nm
By Mark LaPedus - 23 Jul, 2015 - Comments: 2

The race toward the 7nm logic node officially kicked off in July, when IBM Research, GlobalFoundries and Samsung jointly rolled out what the companies claim are the industry’s first 7nm test chips with functional transistors. They're not alone, of course. Intel and TSMC also are racing separately to develop 7nm technology. And in the R&D labs, chipmakers also are working on technologies f... » read more

System Bits: July 21
By Ann Mutschler - 21 Jul, 2015 - Comments: 0

White graphene can take the heat According to researchers at Rice University, 3D boron nitride structures excel at thermal management for electronics. Rice researchers Rouzbeh Shahsavari and Navid Sakhavand have completed the first theoretical analysis of how 3D boron nitride might be used as a tunable material to control heat flow in such devices. In its 2D form, hexagonal boron nitride... » read more

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