Gearing Up For High-NA EUV


The semiconductor industry is moving full speed ahead to develop high-NA EUV, but bringing up this next generation lithography system and the associated infrastructure remains a monumental and expensive task. ASML has been developing its high-numerical aperture (high-NA) EUV lithography line for some time. Basically, high-NA EUV scanners are the follow-on to today’s EUV lithography systems... » read more

Progress On General-Purpose Quantum Computers


The race is on to scale up quantum computing, transforming it from an esoteric research tool into a commercially viable, general-purpose machine. Special-purpose quantum computers have been available for several years now. Systems like D-Wave’s Advantage focus on specific classes of problems that are amenable to modeling as quantum systems. Still, the ultimate goal of having a general purp... » read more

Week In Review: Manufacturing, Test


Chipmakers TSMC posted its results for the quarter and confirmed its long-awaited plans to build a fab in Japan. It’s not a leading-edge fab, but rather a plant for 28nm/22nm processes. “The company confirmed plans to build a new fab in Japan for 22nm + 28nm,” said Aaron Rakers, an analyst at Wells Fargo, in a research note. “An average 22/28nm fab costs ~$4-5B range per 45k wspm. Fab ... » read more

Week In Review: Manufacturing, Test


Government policy Hoping to resolve the ongoing worldwide chip shortage situation, the U.S. Department of Commerce late last month launched a “request for information (RFI)” initiative, which involved sending questionnaires to various semiconductor companies. The U.S. government is asking all parts of the supply chain – producers, consumers, and intermediaries – to voluntarily share in... » read more

Week In Review: Manufacturing, Test


Market research For some time, the semiconductor industry has experienced acute shortages. The automotive industry has suffered the most. When will this all end? “Shortages have become more acute for many products in the near term because the growth in demand is greater than the increase in wafer and packaging capacity that was anticipated by the foundry and semiconductor vendors. To date... » read more

Week In Review: Design, Low Power


Valens Semiconductor began trading on the New York Stock Exchange as VLN after a merger with special-purpose acquisition company (SPAC) PTK Acquisition Corp. Valens offers high-speed connectivity chips for the audio-video and automotive markets, including its HDBaseT technology for connectivity between ultra-HD video sources and remote displays and its in-vehicle high-speed links. The transacti... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive GM’s self-driving car Cruise and Alphabet’s Waymo have won permits to offer rides to passengers in California. Ford Motor Company announced it is expanding its electric pickup truck assembly lines. With SK Innovation, Ford will create a 3,600-acre mega campus in west Tennessee to produce electric trucks. The company estimates the campus will add 6,000 new jobs to the economy.... » read more

EDA Vendors Widen Use Of AI


EDA vendors are widening the use of AI and machine learning to incorporate multiple tools, providing continuity and access to consistent data at multiple points in the semiconductor design flow. While gaps remain, early results from a number of EDA tools providers point to significant improvements in performance, power, and time to market. AI/ML has been deployed for some time in EDA. Still,... » read more

Week In Review: Manufacturing, Test


Markets Worldwide semiconductor industry revenue is expected to grow 17.3% in 2021, compared with 10.8% in 2020, according to a new IDC report. Segment breakdown is as follows: [table id=5 /] “Semiconductor wafer prices increased in 1H21 and IDC expects increases to continue for the rest of 2021 due to material costs and opportunity cost in mature process technologies. Overall, IDC pre... » read more

Building Complex Chips That Last Longer


Semiconductor Engineering sat down to talk about design challenges in advanced packages and nodes with John Lee, vice president and general manager for semiconductors at Ansys; Shankar Krishnamoorthy, general manager of Synopsys' Design Group; Simon Burke, distinguished engineer at Xilinx; and Andrew Kahng, professor of CSE and ECE at UC San Diego. This discussion was held at the Ansys IDEAS co... » read more

← Older posts Newer posts →