tag: Intel

Blog Review: Jan. 8
By Jesse Allen - 08 Jan, 2020 - Comments: 0

Synopsys' Taylor Armerding digs into the privacy and security concerns surrounding connected toys and argues that the current practice of consumers bearing much of the burden to determine what is safe is not viable. In a podcast, Mentor's John McMillan looks back at the past decade in technology and what the next may hold in store as areas like AI and automotive get going. Cadence's Madha... » read more

The Week In Review: Semiconductors
By SE Staff - 27 Dec, 2019 - Comments: 0

The tech-centric NASDAQ index this week broke 9,000, which was a first. Key to the latest run-up were reports of a breakthrough on the trade war with China and continued low interest rates. Chuck Peddle, who helped democratize computing and fuel Moore's Law with his $25 processor chip, passed away last week. Peddle designed the MOS Technology 6502, which was the basis for the KIM-1 single-bo... » read more

Where Technology Breakthroughs Are Needed
By Mark LaPedus - 23 Dec, 2019 - Comments: 2

After years of delays, extreme ultraviolet (EUV) lithography is finally in production at the 7nm logic node with 5nm in the works. EUV, a next-generation lithography technology, certainly will help chipmakers migrate to the next nodes. But EUV doesn’t solve every problem. Nor does it address all challenges in the semiconductor industry. Not by a long shot. To be sure, the industry needs... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Dec, 2019 - Comments: 0

Fab tools and materials In a blog, David Haynes, managing director of strategic marketing at Lam Research, talks about the IoT and automotive chip markets, which are fabricated at a wide range of technology nodes. Hoya recently made an unsolicited $1.4 billion bid to acquire NuFlare, a supplier of e-beam mask writers and other equipment. Click here for more information. Hoya makes several p... » read more

Week In Review: Design, Low Power
By Jesse Allen - 20 Dec, 2019 - Comments: 0

M&A Intel acquired Habana Labs, a maker of programmable deep learning accelerators for the data center, for approximately $2 billion. Based in Israel, Habana was founded in 2016 but only emerged from stealth in September 2018 with the release of its first inference chip. Intel's VC arm, Intel Capital, previously invested in the startup. Intel has made numerous M&A moves in the AI space... » read more

What Worked, What Didn’t In 2019
By Brian Bailey - 19 Dec, 2019 - Comments: 1

2019 has been a tough year for semiconductor companies from a revenue standpoint, especially for memory companies. On the other hand, the EDA industry has seen another robust growth year. A significant portion of this disparity can be attributed to the number of emerging technology areas for semiconductors, none of which has reached volume production yet. Some markets continue to struggle, a... » read more

What’s Next For High Bandwidth Memory
By Mark LaPedus - 17 Dec, 2019 - Comments: 1

A surge in data is driving the need for new IC package types with more and faster memory in high-end systems. But there are a multitude of challenges on the memory, packaging and other fronts. In systems, for example, data moves back and forth between the processor and DRAM, which is the main memory for most chips. But at times this exchange causes latency and power consumption, sometimes re... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Dec, 2019 - Comments: 0

Chipmakers and OEMs TrendForce has released its projected foundry rankings for the fourth quarter of 2019. TSMC remains in first place, followed by Samsung, GlobalFoundries and UMC, according to the firm. “TrendForce projects the foundry industry’s 4Q19 revenue performance to exceed previous expectations,” according to the firm. “Nonetheless, the ongoing U.S-China trade war and uncerta... » read more

Week in Review: IoT, Security and Automotive
By SE Staff - 13 Dec, 2019 - Comments: 0

Internet of Things Western Digital Corp. and Codasip are working together on Western Digital’s SweRV Core EH1, which is a RISC-V core with a 32-bit, dual superscalar, 9-stage pipeline architecture. The core, launched earlier this is aimed at embedded devices supporting data-intensive edge applications, such as storage controllers, industrial IoT, real-time analytics in surveillance systems, ... » read more

System-in-Package For Heterogeneous Designs
By Paul McLellan - 12 Dec, 2019 - Comments: 1

System integration is increasingly being done using 3D packaging technologies rather than integrating everything onto a huge SoC. One motivation is the ability to not just to split up a design in a single process, but to package die from different processes. Sometimes there are economic reasons. Several presentations at HOT CHIPS had a partition of the design into the processor itself, and a... » read more

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