Heterogenous Integration Expertise for Sensors and MEMS Packaging and Assembly

By Promex Industries - 18 Dec, 2024 - Comments: 0

Sensors and microelectromechanical systems (MEMS) are unlocking new design possibilities for miniature devices used in healthcare, smart systems, consumer electronics, and more. Designers need a partner experienced with Heterogenous Integration (HI) to assemble the unique components for these devices and address the complications of these integrations. In this white paper, you will learn: ... » read more

Flip-Chip Bonding Technique To Excite LN Resonators Via Noncontact Electrodes (Yale)

By Technical Paper Link - 09 Sep, 2024 - Comments: 0

A new technical paper titled "Noncontact excitation of multi-GHz lithium niobate electromechanical resonators" was published by researchers at Yale University. Abstract "The demand for high-performance electromechanical resonators is ever-growing across diverse applications, ranging from sensing and time-keeping to advanced communication devices. Among the electromechanical materials being ... » read more

Fano Resonance in a Si PIC Using a Piezoelectrically Driven Mechanism (Ghent, imec)

By Technical Paper Link - 06 Sep, 2024 - Comments: 0

A new technical paper titled "Piezoelectrically driven Fano resonance in silicon photonics" was published by researchers at Ghent University and imec. Abstract "Piezoelectric optomechanical platforms provide a promising avenue for efficient signal transduction between microwave and optical domains. Lead zirconate titanate (PZT) thin film stands out as a compelling choice for building such... » read more

Fluid Dispensing For Packaging Today’s Devices

By Nordson Test And Inspection - 12 Dec, 2023 - Comments: 0

Fluid dispensing systems are evolving in order to address the challenges that system-in-package (SiP) and micromechanical systems (MEMS) packages face, especially in regard to tight geometries and assembly processes. These packages, used in smartphones, have become more miniaturized, and as a result, have created added value in the market. However, they include a variety of small dies or dev... » read more

Research Bits: Nov. 28

By Jesse Allen - 28 Nov, 2023 - Comments: 0

Switchable photodetector and neuromorphic vision sensor Researchers from the Institute of Metal Research at the Chinese Academy of Sciences built a device that can be switched between being a photodetector and neuromorphic vision sensor by adjusting the operating voltage. The trench-bridged GaN/Ga2O3/GaN heterojunction array device exhibits volatile and non-volatile photocurrents at low and hi... » read more

Using Atomic Vacancies In Silicon Carbide To Measure The Stability And Quality Of Acoustic Resonators

By Technical Paper Link - 14 Nov, 2023 - Comments: 0

A technical paper titled “Spin-acoustic control of silicon vacancies in 4H silicon carbide” was published by researchers at Harvard University and Purdue University. Abstract: "Bulk acoustic resonators can be fabricated on the same substrate as other components and can operate at various frequencies with high quality factors. Mechanical dynamic metrology of these devices is challenging as... » read more

CMOS Compatible Materials With Quantum Defects Suitable For Room Temperature Applications

By Technical Paper Link - 11 Oct, 2023 - Comments: 0

A technical paper titled “Thin Film Materials for Room Temperature Quantum Applications” was published by researchers at Marquette University. Abstract: "Thin films with quantum defects are emerging as a potential platform for quantum applications. Quantum defects in some thin films arise due to structural imperfections, such as vacancies or impurities. These defects generate localized el... » read more

Nine Essential Criteria To Achieve A Successful Bonding Process

By Brewer Science - 14 Aug, 2023 - Comments: 0

A photosensitive permanent bonding material enables the creation of high-quality permanent bonds between dissimilar materials used in the creation of MEMS and sensors. Having a thorough understanding of the materials and product performance is crucial to the success of the end application. In this article, we explore nine criteria used to evaluate a polymeric photosensitive permanent bonding ma... » read more

A 3D MEMS Coaxial Socket Overcomes Challenges In Semiconductor Package Chip Testing

By Technical Paper Link - 20 Jul, 2023 - Comments: 0

A technical paper titled "Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing" was published by researchers at Yonsei University and Protec MEMS Technology. Abstract: "With the continuous reduction in size and increase in density of semiconductor devices, there is a growing demand for contact solutions tha... » read more

Developing A Customized RISC-V Core For MEMS Sensors

By Tora Fridholm - 22 Jun, 2023 - Comments: 0

We recently described how Codasip Labs is working with the NimbleAI project to push the boundaries of neuromorphic vision. Let’s talk about another cool project. This project is focused on another sense, hearing. We will use our unique Codasip Studio design toolset to develop a customized RISC-V core for MEMS (micro-electro-mechanical system) sensors. Again, technology is inspired by bio... » read more

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tag: MEMS

Heterogenous Integration Expertise for Sensors and MEMS Packaging and Assembly

Flip-Chip Bonding Technique To Excite LN Resonators Via Noncontact Electrodes (Yale)

Fano Resonance in a Si PIC Using a Piezoelectrically Driven Mechanism (Ghent, imec)

Fluid Dispensing For Packaging Today’s Devices

Research Bits: Nov. 28

Using Atomic Vacancies In Silicon Carbide To Measure The Stability And Quality Of Acoustic Resonators

CMOS Compatible Materials With Quantum Defects Suitable For Room Temperature Applications

Nine Essential Criteria To Achieve A Successful Bonding Process

A 3D MEMS Coaxial Socket Overcomes Challenges In Semiconductor Package Chip Testing

Developing A Customized RISC-V Core For MEMS Sensors

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