Integrating MEMS with Standardized Silicon Photonics Technology


A new technical paper titled "Integrated silicon photonic MEMS" was published by researchers at EPFL, University of Sydney, CSEM, KTH Royal Institute of Technology, Ghent University, Imec, and Tyndall National Institute. Abstract Excerpt "Here, we introduce a silicon photonic MEMS platform consisting of high-performance nano-opto-electromechanical devices fully integrated alongside standar... » read more

Unknowns And Challenges In Advanced Packaging


Dick Otte, CEO of Promex Industries, sat down with Semiconductor Engineering to talk about unknowns in material properties, the impact on bonding, and why environmental factors are so important in complex heterogeneous packages. What follows are excerpts of that conversation. SE: Companies have been designing heterogeneous chips to take advantage of specific applications or use cases, but th... » read more

Research Bits: Jan. 17


Ionic circuit for neural nets Researchers at Harvard University and DNA Script developed an ionic circuit comprising hundreds of ionic transistors for neural net computing. While ions in water move slower than electrons in semiconductors, the team noted that the diversity of ionic species with different physical and chemical properties could be harnessed for more diverse information process... » read more

Automotive MEMS Accelerometer Design Verification: A Real Life Example


Standard Finite Element (FE) models, especially those that incorporate multiple physical domains, consist of detailed representations of a device that include a large number of Degrees of Freedom (DoF). The Degrees of Freedom in a design are the number of independent variables or parameters needed to describe the motion or state of the device. Generally, the larger the number of Degrees of Free... » read more

Week In Review: Semiconductor Manufacturing, Test


Fallout from the new U.S. export controls continues. Under new regulations, companies looking to supply Chinese chipmakers with advanced manufacturing equipment (<14nm) must first obtain a license from the U.S. Department of Commerce. In addition, U.S. persons (citizens and permanent residents) are barred from supporting China’s advanced chip development or production without a license. ... » read more

Week In Review: Manufacturing, Test


Highlights from ITC The hot topic at this week’s International Test Conference (ITC) was tackling silent data corruption, with panel discussions, papers, and Google’s Parthasarathy Ranganathan’s keynote address all emphasizing the urgency of the issue. In the past two years Meta, Google, and Microsoft have reported on silent errors, errors not detected at test, which are adversely impact... » read more

Why Gas Sensing Is Becoming Localized


Sensors that measure air flow, air quality, and chemical makeup are being deployed increasingly for both indoor and outdoor environmental monitoring, in homes, automobiles, and industrial facilities. But despite a raft of new applications for these devices, the necessary standards needed to calibrate and compare those devices are trailing well behind rapid development of new types and combinati... » read more

Ultra-Low Resonance Frequency MEMS Gravimeter With Off-Resonance Closed-Loop Control


This paper reports on a MEMS gravimeter that has a closed-loop system to maintain an ultra-low resonance frequency of 1Hz. The low resonance frequency is attained by using a spring that is the resultant of positive mechanical stiffnesses and negative electrical stiffnesses. Voltage-tunability of the electrical stiffness enables ultra-small and tunable total stiffness. To attain a quick response... » read more

There Is Plenty Of Room At The Top: Imagining Miniaturized Electro-Mechanical Switches In Low-Power Computing Applications


The first computers were built using electro-mechanical components, unlike today’s modern electronic systems. Alan Turing’s cryptanalysis multiplier and Konrad Zuse’s Z2 were invented and built in the first half of the 20th century, and were among the first computers ever constructed. Electro-mechanical switches and relays performed logic operations in these machines. Even after computers... » read more

Research Bits: March 1


Large-scale phased array Researchers at Princeton University developed a large-scale high-frequency antenna array using thin-film materials. “To achieve these large dimensions, people have tried discrete integration of hundreds of little microchips. But that’s not practical — it’s not low-cost, it’s not reliable, it’s not scalable on a wireless systems level,” said senior stud... » read more

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