Process To Produce High Aspect Ratio Electroplated Copper Pillars On 300 mm Wafers

By Veeco - 16 Oct, 2019 - Comments: 0

This work provides details of a complete and partially optimized process to manufacture high aspect ratio copper pillars with heights of up to 80 µm on 200 and 300 mm wafers. Across wafer uniformity data for all materials and process steps are given. Results will show excellent resist adhesion on copper and electroplating durability. Cross sectional SEM analysis of resist and electroplated pil... » read more

Implementing A Multi-Domain System

By Mentor, a Siemens Business - 02 Oct, 2019 - Comments: 0

IoT systems are multi-domain designs that often require AMS, Digital, RF, photonics and MEMS elements within the system. Tanner EDA provides an integrated, top-down design flow for IoT design that supports all these design domains. Learn more about key solutions that the Tanner design flow offers for successful IoT system design and verification. To read more, click here. » read more

Power/Performance Bits: Sept. 11

By Jesse Allen - 11 Sep, 2019 - Comments: 0

Thread transistor Researchers at Tufts University developed a thread-based transistor that can be fashioned into simple, all-thread based logic circuits and integrated circuits which could be woven into fabric or worn on the skin, or even surgically implanted. The thread-based transistor (TBT) is made of a linen thread coated with carbon nanotubes, creating a semiconductor surface. Two thin... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 06 Sep, 2019 - Comments: 0

China's DRAM efforts Two memory vendors from China, Tsinghua Unigroup and ChangXin Memory Technology, have disclosed more details about their respective efforts to enter the DRAM arena. As reported, Tsinghua Unigroup wants to enter the DRAM business. Now, the China-based firm has secured land to build a new DRAM fab. The firm recently signed an agreement with the Chongqing government to e... » read more

Manufacturing Bits: Aug. 5

By Mark LaPedus - 05 Aug, 2019 - Comments: 0

Chemical weapon sensors Using nanoelectromechanical system (NEMS) technologies and other parts, Sandia National Laboratories has developed a tiny gas chromatograph sensor for use in detecting toxic gases and chemical weapons. Chemical identification involves the use of various instruments and systems. Larger systems are used in the lab. A portable version, called a mass spectrometer, is ava... » read more

200mm Cools Off, But Not For Long

By Mark LaPedus - 18 Jul, 2019 - Comments: 4

After years of acute shortages, 200mm fab capacity is finally loosening up, but the supply/demand picture could soon change with several challenges on the horizon. 200mm fabs are older facilities with more mature processes, although they still churn out a multitude of today’s critical chips, such as analog, MEMS, RF and others. From 2016 to 2018, booming demand for these and other chips ca... » read more

HW/SW Design At The Intelligent Edge

By Ann Mutschler - 08 Jul, 2019 - Comments: 0

Adding intelligence to the edge is a lot more difficult than it might first appear, because it requires an understanding of what gets processed where based on assumptions about what the edge actually will look like over time. What exactly falls under the heading of Intelligent Edge varies from one person to the next, but all agree it goes well beyond yesterday’s simple sensor-based IoT dev... » read more

CEO Outlook: Rising Costs, Chiplets, And A Trade War

By Ed Sperling - 26 Jun, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss what's changing across the semiconductor industry with Wally Rhines, CEO emeritus at Mentor, a Siemens Business; Jack Harding, president and CEO of eSilicon; John Kibarian, president and CEO of PDF Solutions; and John Chong, vice president of product and business development for Kionix. What follows are excerpts of that discussion, which was held in... » read more

New Advancements in Using Statistical Models as Part of a Standard MEMS Design Flow

By Coventor - 19 Jun, 2019 - Comments: 0

This paper presents the benefits of using statistical models during MEMS design, through the virtual reproduction of a test structure for measuring a beam’s pull-in voltage. This electrical measurement is used as a functional indicator of the process quality for manufactured wafers. Statistical variations of process parameters (material properties, silicon thickness, sidewall angle and edge s... » read more

CEO Outlook: It Gets Much Harder From Here

By Ed Sperling - 03 Jun, 2019 - Comments: 0

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tag: MEMS

Process To Produce High Aspect Ratio Electroplated Copper Pillars On 300 mm Wafers

Implementing A Multi-Domain System

Power/Performance Bits: Sept. 11

Week In Review: Manufacturing, Test

Manufacturing Bits: Aug. 5

200mm Cools Off, But Not For Long

HW/SW Design At The Intelligent Edge

CEO Outlook: Rising Costs, Chiplets, And A Trade War

New Advancements in Using Statistical Models as Part of a Standard MEMS Design Flow

CEO Outlook: It Gets Much Harder From Here

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