MEMS And Sensor Tech For The Next Decade

By Maria Vetrano - 17 Oct, 2019 - Comments: 0

Most of today’s blockbuster MEMS products – from pressure sensors and resonators to accelerometers and microphones – originated from academic research, a trend that Alissa M. Fitzgerald, Founder & Managing Member, A.M. Fitzgerald & Associates, expects to continue. While many of these potentially game-changing new technologies will require many more years of intensive development a... » read more

Process To Produce High Aspect Ratio Electroplated Copper Pillars On 300 mm Wafers

By Veeco - 16 Oct, 2019 - Comments: 0

This work provides details of a complete and partially optimized process to manufacture high aspect ratio copper pillars with heights of up to 80 µm on 200 and 300 mm wafers. Across wafer uniformity data for all materials and process steps are given. Results will show excellent resist adhesion on copper and electroplating durability. Cross sectional SEM analysis of resist and electroplated pil... » read more

Implementing A Multi-Domain System

By Mentor, a Siemens Business - 02 Oct, 2019 - Comments: 0

IoT systems are multi-domain designs that often require AMS, Digital, RF, photonics and MEMS elements within the system. Tanner EDA provides an integrated, top-down design flow for IoT design that supports all these design domains. Learn more about key solutions that the Tanner design flow offers for successful IoT system design and verification. To read more, click here. » read more

Power/Performance Bits: Sept. 11

By Jesse Allen - 11 Sep, 2019 - Comments: 0

Thread transistor Researchers at Tufts University developed a thread-based transistor that can be fashioned into simple, all-thread based logic circuits and integrated circuits which could be woven into fabric or worn on the skin, or even surgically implanted. The thread-based transistor (TBT) is made of a linen thread coated with carbon nanotubes, creating a semiconductor surface. Two thin... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 06 Sep, 2019 - Comments: 0

China's DRAM efforts Two memory vendors from China, Tsinghua Unigroup and ChangXin Memory Technology, have disclosed more details about their respective efforts to enter the DRAM arena. As reported, Tsinghua Unigroup wants to enter the DRAM business. Now, the China-based firm has secured land to build a new DRAM fab. The firm recently signed an agreement with the Chongqing government to e... » read more

Manufacturing Bits: Aug. 5

By Mark LaPedus - 05 Aug, 2019 - Comments: 0

Chemical weapon sensors Using nanoelectromechanical system (NEMS) technologies and other parts, Sandia National Laboratories has developed a tiny gas chromatograph sensor for use in detecting toxic gases and chemical weapons. Chemical identification involves the use of various instruments and systems. Larger systems are used in the lab. A portable version, called a mass spectrometer, is ava... » read more

200mm Cools Off, But Not For Long

By Mark LaPedus - 18 Jul, 2019 - Comments: 4

After years of acute shortages, 200mm fab capacity is finally loosening up, but the supply/demand picture could soon change with several challenges on the horizon. 200mm fabs are older facilities with more mature processes, although they still churn out a multitude of today’s critical chips, such as analog, MEMS, RF and others. From 2016 to 2018, booming demand for these and other chips ca... » read more

HW/SW Design At The Intelligent Edge

By Ann Mutschler - 08 Jul, 2019 - Comments: 0

Adding intelligence to the edge is a lot more difficult than it might first appear, because it requires an understanding of what gets processed where based on assumptions about what the edge actually will look like over time. What exactly falls under the heading of Intelligent Edge varies from one person to the next, but all agree it goes well beyond yesterday’s simple sensor-based IoT dev... » read more

CEO Outlook: Rising Costs, Chiplets, And A Trade War

By Ed Sperling - 26 Jun, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss what's changing across the semiconductor industry with Wally Rhines, CEO emeritus at Mentor, a Siemens Business; Jack Harding, president and CEO of eSilicon; John Kibarian, president and CEO of PDF Solutions; and John Chong, vice president of product and business development for Kionix. What follows are excerpts of that discussion, which was held in... » read more

New Advancements in Using Statistical Models as Part of a Standard MEMS Design Flow

By Coventor - 19 Jun, 2019 - Comments: 0

This paper presents the benefits of using statistical models during MEMS design, through the virtual reproduction of a test structure for measuring a beam’s pull-in voltage. This electrical measurement is used as a functional indicator of the process quality for manufactured wafers. Statistical variations of process parameters (material properties, silicon thickness, sidewall angle and edge s... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

Defining The Chiplet Socket

The industry may have started with the wrong approach for enabling a third-party chiplet ecosystem, but who will step in and fix it?

by Brian Bailey

tag: MEMS

MEMS And Sensor Tech For The Next Decade

Process To Produce High Aspect Ratio Electroplated Copper Pillars On 300 mm Wafers

Implementing A Multi-Domain System

Power/Performance Bits: Sept. 11

Week In Review: Manufacturing, Test

Manufacturing Bits: Aug. 5

200mm Cools Off, But Not For Long

HW/SW Design At The Intelligent Edge

CEO Outlook: Rising Costs, Chiplets, And A Trade War

New Advancements in Using Statistical Models as Part of a Standard MEMS Design Flow

Trending Articles

NAND Flash Targets 1,000 Layers

Testing For Thermal Issues Becomes More Difficult

Auto Chip Aging Accelerates In Hot Climates

Is In-Memory Compute Still Alive?

Top-Down Vs. Bottom-Up Chiplet Design

Knowledge Centers
Entities, people and technologies explored