Chip Industry Week In Review

By The SE Staff - 28 Mar, 2025 - Comments: 0

McKinsey issued a new report on the state of the chemical supply chain for semiconductors in the U.S., citing potential shortages of high-purity materials such as tungsten, aluminum and copper, lack of access to CMP slurries and photoresists for EUV, and rising competition for high-k precursors that can fetch higher prices outside of the U.S. CSIS weighed in on the U.S. goverment's recent ... » read more

Research Bits: Mar. 18

By Jesse Allen - 18 Mar, 2025 - Comments: 0

High-frequency signal conversion Researchers from ETH Zurich developed a plasmonic modulator capable of converting electrical signals into optical signals with a frequency of over a terahertz. The modulator is a tiny nanostructure made up of various materials, including gold, and makes use of the interaction between light and free electrons within the gold. It converts signals directly, red... » read more

Chip Industry Week In Review

By The SE Staff - 14 Mar, 2025 - Comments: 0

ASML and imec signed a five-year strategic partnership to advance semiconductor innovation and sustainable technology. The collaboration will leverage ASML’s full product portfolio, including high-NA EUV, DUV immersion, and advanced metrology tools, within imec’s pilot line for sub-2nm R&D. Supported by EU and national funding, it will also drive research in silicon photonics, memory, a... » read more

Chip Industry Technical Paper Roundup: Mar. 10

By Linda Christensen - 10 Mar, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=412 /] Find more semiconductor research papers here. » read more

Thermally Aware Chiplet Placement Algorithm Based on Automatic Differentiation (MIT, IBM)

By Technical Paper Link - 07 Mar, 2025 - Comments: 0

A new technical paper titled "DiffChip: Thermally Aware Chip Placement with Automatic Differentiation" was published by researchers at MIT and IBM. Abstract "Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads to significant thermal management challenges, requiring ... » read more

Chip Industry Week In Review

By The SE Staff - 07 Mar, 2025 - Comments: 0

The Malaysian government signed a deal with Arm to kickstart a chip design ecosystem. Until now, Malaysia has focused on packaging and test. Adding chip design represents a major change in focus. The country will pay SoftBank $250 million over 10 years for Arm’s chip design IP and train 10,000 engineers. Global chip sales reached $56 billion in January, up nearly 18% from the same period i... » read more

Chip Industry Technical Paper Roundup: Mar. 4

By Linda Christensen - 04 Mar, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=410 /] Find more semiconductor research papers here. » read more

Research Bits: Mar. 4

By Jesse Allen - 04 Mar, 2025 - Comments: 0

Fiber computer Researchers from Massachusetts Institute of Technology (MIT), Rhode Island School of Design, and Brown University developed a programmable elastic fiber computer that could be woven into clothing to monitor health conditions and physical activity. Clothing created using the fiber computer was reported as comfortable and machine washable. The single elastic fiber computer cont... » read more

Chip Industry Week In Review

By The SE Staff - 28 Feb, 2025 - Comments: 0

Intel said its new fab in Licking County, Ohio will be delayed due to financial struggles and a need to align chip production with market demand, reported the Columbus Dispatch. Construction is now estimated to be completed in 2030, with operations to start in 2030 or 2031. The company said it already has invested $3.7 billion locally. Apple plans to invest more than $500 billion in the U.S... » read more

SW-HW Co-Design Mitigation To Strengthen ASLR Against Microarchitectural Attacks (MIT)

By Technical Paper Link - 26 Feb, 2025 - Comments: 0

A technical paper titled "Oreo: Protecting ASLR Against Microarchitectural Attacks" was published by researchers at MIT. Abstract "Address Space Layout Randomization (ASLR) is one of the most prominently deployed mitigations against memory corruption attacks. ASLR randomly shuffles program virtual addresses to prevent attackers from knowing the location of program contents in memory. Microa... » read more

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tag: MIT

Chip Industry Week In Review

Research Bits: Mar. 18

Chip Industry Week In Review

Chip Industry Technical Paper Roundup: Mar. 10

Thermally Aware Chiplet Placement Algorithm Based on Automatic Differentiation (MIT, IBM)

Chip Industry Week In Review

Chip Industry Technical Paper Roundup: Mar. 4

Research Bits: Mar. 4

Chip Industry Week In Review

SW-HW Co-Design Mitigation To Strengthen ASLR Against Microarchitectural Attacks (MIT)

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