Chip Industry Week in Review

By The SE Staff - 30 May, 2025 - Comments: 0

The U.S. Commerce Department is tightening controls on EDA software sold to China by imposing additional license requirements. EDA companies are assessing the impact. Details on how broad the restrictions will be are still pending. The U.S. Federal Trade Commission (FTC) will require Synopsys and Ansys to divest key software assets — including optical, photonic, and RTL power analysis tool... » read more

Chip Industry Technical Paper Roundup: May 28

By Linda Christensen - 28 May, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=434 /] Find more semiconductor research papers here. » read more

Doping Mechanism Of Pure Nitric Oxide In Tungsten Diselenide Transistors (Purdue, MIT, NYCU)

By Technical Paper Link - 22 May, 2025 - Comments: 0

A technical paper titled "Uncovering the doping mechanism of nitric oxide in high-performance P-type WSe2 transistors" was published by researchers at Purdue University, MIT and National Yang Ming Chiao Tung University (with support from Intel Corporation). "Atomically thin two-dimensional (2D) semiconductors are promising candidates for beyond-silicon electronic devices. However, an excessi... » read more

Research Bits: May 13

By Jesse Allen - 13 May, 2025 - Comments: 0

Benchmarking 3D-IC cooling Researchers from Massachusetts Institute of Technology (MIT) and HRL Laboratories developed a specialized chip to test and validate cooling solutions for packaged chip stacks. The chip dissipates extremely high power, generating heat through the silicon layer and in localized hot spots to mimic high-performance logic chips. It then uses diodes to measure temperatu... » read more

Chip Industry Technical Paper Roundup: May 6

By Linda Christensen - 06 May, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=427 /] Find more semiconductor research papers here. » read more

Automotive Security Risks Associated With Wireless Communication

By Technical Paper Link - 01 May, 2025 - Comments: 0

A new technical paper titled "Revisiting Wireless Cyberattacks on Vehicles" was published by researchers at Comillas Pontifical University and MIT. Abstract "The automotive industry has been a prime target for cybercriminals for decades, with attacks becoming more sophisticated as vehicles integrate advanced digital technologies. In response, new standards and regulations have been introduc... » read more

Chip Industry Week in Review

By The SE Staff - 25 Apr, 2025 - Comments: 0

To listen to the podcast version, click here. TSMC unveiled an unusually detailed roadmap at this week's North America Technology Symposium, including future architectures for 3D-ICs for high-performance computing and small, extremely low-power chips for AR/VR glasses, and two implementations of system-on-wafer. Fig. 1: TSMC's future packaging and stacking roadmap. Source: TSMC The ... » read more

Research Bits: April 22

By Jesse Allen - 22 Apr, 2025 - Comments: 0

PIC heterogeneous integration Researchers from Hewlett Packard Labs, Indian Institutes of Technology Madras, Microsoft Research, and University of Michigan built an AI acceleration platform based on heterogeneously integrated photonic ICs. The PIC combines silicon photonics along with III-V compound semiconductors that functionally integrate lasers and optical amplifiers to reduce optical l... » read more

Chip Industry Technical Paper Roundup: Apr. 7

By Linda Christensen - 07 Apr, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=419 /] Find more semiconductor research papers here. » read more

Emerging Cybersecurity Risks in Connected Vehicles, With Focus On In-Vehicle and Vehicle-Edge Platforms

By Technical Paper Link - 04 Apr, 2025 - Comments: 0

A new technical paper titled "Security Risks and Designs in the Connected Vehicle Ecosystem: In-Vehicle and Edge Platforms" was published by researchers at Università di Pisa, Ford Motor Company, MIT, and the Institute of Informatics and Telematics (Pisa). Abstract "The evolution of Connected Vehicles (CVs) has introduced significant advancements in both in-vehicle and vehicle-edge platfor... » read more

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Chip Industry Week in Review

Chip Industry Technical Paper Roundup: May 28

Doping Mechanism Of Pure Nitric Oxide In Tungsten Diselenide Transistors (Purdue, MIT, NYCU)

Research Bits: May 13

Chip Industry Technical Paper Roundup: May 6

Automotive Security Risks Associated With Wireless Communication

Chip Industry Week in Review

Research Bits: April 22

Chip Industry Technical Paper Roundup: Apr. 7

Emerging Cybersecurity Risks in Connected Vehicles, With Focus On In-Vehicle and Vehicle-Edge Platforms

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