tag: Mentor Graphics

How To Get The Most Power While Being Cool To The Touch
By Robin Bornoff - 09 Jul, 2015 - Comments: 0

Traditional electronics thermal management in high power applications such as telecommunication, networking, and computing involves keeping the operating junction temperatures at, or below, maximum rated values for the intended application, often with fans, blowers, heatsinks, etc. Mobile consumer electronics also have to be thermally managed to ensure that when a person uses the product, ‘to... » read more

Next-Generation Power-Aware CDC Verification: What Have We Learned?
By Mentor, a Siemens Business - 08 Jul, 2015 - Comments: 0

Reducing power consumption is essential to mobile and handheld application chips where reduced power contributes to longer battery life while minimally impacting performance. Reduced power consumption is achieved by partitioning an ASIC into multiple power domains, then controlling the power of these domains by switching off power or reducing voltage levels. Reduction of power consumption is fu... » read more

Blog Review: July 8
By Jesse Allen - 08 Jul, 2015 - Comments: 0

In this week's picks for his top five technology articles, Ansys' Justin Nescott rolls in with two ways for cyclists to improve safety, the development of the wheelchair and the advancement of fingerprint scanners for healthcare and security. With the launch of the BBC Micro:bit, one part of a program to inspire young people to get into coding and digital creation, ARM's Gary Atkinson shows ... » read more

EDA Sales Strong Again
By Ed Sperling - 07 Jul, 2015 - Comments: 0

EDA and IP sales were robust again in Q1, up 7.5% to $1.877 billion compared with $1.746 billion in the same period in 2014, according to the EDA Consortium. On the upside, IP revenue rose 19.3% to $618.1 million; services revenue increased 6.8% to $104.4 million; and PCB and multi-chip module revenue increased 1.1% to $161.5 million. On the downside, CAE—the largest single category—... » read more

How Much Security Is Enough?
By Ed Sperling - 06 Jul, 2015 - Comments: 3

Semiconductor Engineering sat down to discuss the current state of [getkc id="223" kc_name="security"] and what must be done in the future, with Denis Noël, head of cyber security solutions at [getentity id="22499" e_name="NXP"]; Serge Leef, vice president of new ventures at [getentity id="22017" e_name="Mentor Graphics"]; Andreas Kuehlman, senior vice president and general manager of the soft... » read more

Securing Modern-Day Devices With Embedded Virtualization And ARM TrustZone Technology
By Mentor, a Siemens Business - 06 Jul, 2015 - Comments: 0

When securing today’s modern devices, it’s not enough to know the type of device you want to secure. Equally important is the process used to develop that device. In this paper, we’ll take a closer look at security as it relates to protecting data, building security into a device, and securing SoCs in multicore architectures. ARM TrustZone technology, which provides a solution for carving... » read more

Executive Insight: Wally Rhines
By Ed Sperling - 01 Jul, 2015 - Comments: 0

Wally Rhines, chairman and CEO of Mentor Graphics, sat down with Semiconductor Engineering to talk about what's changing across a wide swath of the industry, where the new opportunities will be, when security will become a real opportunity for EDA, and why Moore's Law will die but progress will continue forever. SE: Looking back over the past year, what's changed and where are the possible r... » read more

Blog Review: July 1
By Jesse Allen - 01 Jul, 2015 - Comments: 0

On the eve of his retirement, Cadence's Richard Goering takes a look back at 30 years of covering EDA: the highlights, the lowlights, and the headlights shining into the future. Established nodes are experiencing a much higher demand than one might normally expect at this point in their lifecycle. Mentor's Michael White examines the dynamics and market forces behind the longevity, and the ch... » read more

Wrong Verification Revolution Offered
By Brian Bailey - 25 Jun, 2015 - Comments: 0

SoC design traditionally has been an ad-hoc process, with implementation occurring at the register transfer level. This is where verification starts, and after the blocks have been verified, it becomes an iterative process of integration and verification that continues until the complete system has been assembled. But today, this methodology has at least two major problems, which were addres... » read more

Thermal Interface Materials: The Unknown Entity?
By Mathew Clark - 25 Jun, 2015 - Comments: 0

Thermal interface materials (TIMs) are becoming more important in all application areas and between different component parts. Any semiconductor, ranging from LEDs to high-power electronics, is becoming smaller, yet producing more power. In many ways the physical design limits have been reached for packaging, allowing entire components to have a total thermal resistance of less than 0.1 K/W. Ho... » read more

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