FD-SOI Meets The IoT


Silicon-on-insulator manufacturing technology has been discussed for many years. IBM has used the partially depleted variation of SOI in its server products, but the fully depleted version has yet to find widespread adoption outside of mil/aero and automotive markets. That may change soon as applications in the Internet of Things ramp, given the requirements for ultra low power and low cost.... » read more

Round-Trip Engineering Key To AUTOSAR-based Development


This paper discusses how round-trip engineering can be used as an iterative development process and describes interoperability between tools from Mentor and MathWorks. Model-based design has become an important component in vehicle manufacturer and supplier development processes. Electronic control units are complex in terms of functionality, connectivity, and variants; therefore automotive ... » read more

Signal Integrity Issues


Semiconductor Engineering sat down to discuss signal integrity with Rob Aitken, research fellow at [getentity id="22186" comment="ARM"]; PV Srinivas, senior director of engineering for the Place & Route Division of [getentity id="22017" e_name="Mentor Graphics"]; and Bernard Murphy, chief technology officer at [getentity id="22026" e_name="Atrenta"]. What follows are excerpts of that conver... » read more

Blog Review: Feb. 4


After the Super Bowl, Ansys' Thierry Marchal looks at making football safer through virtual prototyping. Sports concussions are a serious danger for athletes from youths to professionals, and modeling head and brain impacts may lead not only to safer football helmets but a better understanding of how to lower the chance of brain injuries in sports. Synopsys' Ray Varghese continues his series... » read more

Back To The Future


The push to the next process node typically has meant that designs get simpler at existing and older nodes because the process technology is more mature and there have been so many chips developed at those nodes—many billions of them—that every possible corner case has been encountered hundreds, if not thousands, of times. That all makes sense in theory, but several key things have chang... » read more

The Week In Review: Design/IoT


Mergers/Acquisitions Lattice Semiconductor agreed to pay $600 million for Silicon Image, which makes connectivity solutions for high-definition content for mobile and consumer electronics. Lattice already makes programmable connectivity solutions, so the combined IP portfolio is expected to strengthen its position in wired and wireless markets. Tools Cadence expanded the tool portfolio it ... » read more

Week 34: January 23, A Perfect Friday


Designer and IP track submissions are up 27% compared to 2014. This is an amazing success and we have to thank all the designer track and IP track subcommittee members for getting the word out and motivating their industry peers to submit in such numbers. Tallying it up, it appears we received the most submissions since we started the designer track back in 2010 (we called it the user track bac... » read more

First Look: 10nm


As the semiconductor industry begins grappling with mass production at 14/16nm process nodes, work is already underway at 10nm. Tools are qualified, IP is characterized, and the first test chips are being produced. It's still too early for production, of course—perhaps three years too early—but there is enough information being collected to draw at least some impressions about just how toug... » read more

Automotive System Design Challenges


The automotive semiconductor market did exceptionally well last year. IHS reported strong vehicle production growth and increased semiconductor content in 2014, and that trend is likely to continue with semiconductor revenue for the automotive segment to reach $31 billion this year, up from $29 billion last year. The market research company affirmed the fastest growing segments for automoti... » read more

Tools And Flows In 2015


This year more than 26 people provided predictions for 2015. Most of these came from the EDA industry, so the results may be rather biased. However, ecosystems are coming closer together in many parts of the semiconductor food chain, meaning that the EDA companies often can see what is happening in dependent industries and in the system design houses. Thus their predictions may have already res... » read more

← Older posts Newer posts →