tag: silicon photonics

Manufacturing Bits: July 7
By Mark LaPedus - 07 Jul, 2015 - Comments: 0

Silicon photonics prototyping A group of European and other research organizations have put the finishing touches on a project to help propel the development of silicon photonics into the commercial market. The project, dubbed ESSenTIAL, enables small- to mid-sized enterprises to develop prototypes and products based on silicon photonics. Funded by the European Commission, the project inclu... » read more

Manufacturing Bits: May 26
By Mark LaPedus - 26 May, 2015 - Comments: 0

Table-top EUV Swinburne University of Technology has developed a table-top extreme ultraviolet (EUV) laser power source. The source could be used to develop a system for use in metrology and other applications. The table-top setup is a new way to generate bright beams of coherent EUV radiation. It may offer a cost-effective alternative to large-scale facilities, such as synchrotrons or free... » read more

System Bits: Feb. 17
By Ann Mutschler - 17 Feb, 2015 - Comments: 2

Can you hear light? Silicon photonics has gained increasing attention as a key driver of lab-on-a-chip biosensors and of faster-than-electronics communication between computer chips. The technology builds on tiny structures known as silicon photonic wires. The wires work because light moves slower in the silicon core than in surrounding air and glass. Thus, the light is trapped inside the wire... » read more

Important Changes Ahead
By Steve Schulz - 12 Jan, 2015 - Comments: 0

Two of Si2's important industry standards efforts will be featured later this month at DesignCon, a popular Silicon Valley event that is now in its 20th year. In the panel entitled, "System-Level Power Modeling—What's the Big Deal?", leading industry experts from AMD, Avago Technologies, Cadence, Docea Power, Qualcomm, and Si2 will focus on the growing need to take a higher level and more... » read more

System Bits: Oct. 28
By Ann Mutschler - 28 Oct, 2014 - Comments: 0

Sensing objects without looking at them In a technique known as “interaction-free measurement,” Yale engineers have created a chip-scale device that senses the presence of an object without interacting with it by using the wave-particle duality of single photons. This work could help propel the field of quantum information processing. The researchers explained that the device uses silic... » read more

The Week In Review: Design
By Ed Sperling - 19 Sep, 2014 - Comments: 0

Tools Open-Silicon uncorked a 28Gbps SerDes evaluation platform, complete with board, test chip and characterization data, which it says will speed up and simplify development of chips for 100G networks. The chip utilizes PHY IP from Semtech. IP Synopsys rolled out MIPI C-PHY verification IP that utilizes a three-phase coding technique for faster camera, display and SoC interfaces. http://... » read more

More Than Moore
By Ed Sperling - 15 Sep, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the value of feature shrinks and what comes next with Steve Eplett, design technology and automation manager at [getentity id="22664" e_name="Open-Silicon"]; Patrick Soheili, vice president and general manager of IP Solutions at [getentity id="22242" e_name="eSilicon"]; Brandon Wang, engineering group director at [getentity id="22032" e_name="Cadenc... » read more

Improving 2.5D Components
By Ed Sperling - 07 Aug, 2014 - Comments: 1

A lot of attention is being focused on improving designs at established, well-tested nodes where processes are mature, yields are high, and costs are under control. So what does this mean to stacking die? For 2.5D architectures, plenty. For 3D, probably not much. Here’s why: The advantage of 2.5D is that it can utilize dies created at whatever node makes sense. While the initial discuss... » read more

Disruptive R&D
By Paula Doe - 17 Jul, 2014 - Comments: 0

Leading university researchers presented their most promising technologies — describing developments ranging from sustainable metal cluster technology (that’s already spawned three notable startups) to resonance-based detection for more accurate MEMS devices — at the new Breakthrough Research Technologies session and the Silicon Innovation Forum at SEMICON West 2014. OSU metal cluster... » read more

Executive Insight: Aart de Geus
By Ed Sperling - 02 Jun, 2014 - Comments: 0

SE: What worries you most? De Geus: Everything I do is with high intensity, and what is of super high intensity right now—and there are challenges and opportunities in it—is that we have the confluence of some very big changes right now happening at the same time. On the technology side, there are multiple intersections. One is the intersection of another 10 years of Moore’s Law—finF... » read more

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