tag: Synopsys

EDA’s Role Grows For Preventing And Identifying Failures
By Karen Heyman - 08 Jun, 2023 - Comments: 0

The front end of design is becoming more tightly integrated with the back end of manufacturing, driven by the rising cost and impact of failures in advanced chips and critical applications. Ironically, the starting point for this shift is failure analysis (FA), which typically happens when a device fails to yield, or worse, when it is returned due to some problem. In production, that leads t... » read more

Using Virtual Metal Fill To Solve Real Design Problems
By Vamsi Thatha - 08 Jun, 2023 - Comments: 0

People learning about semiconductor manufacturing might well be confused by the concept of metal fill. It seems perfectly intuitive that laying out a complex chip will result in some regions with fewer transistors and metal interconnect than others. It makes sense that there will be areas that are mostly empty. So why spend money on more complicated masks and on extra metal just to fill those e... » read more

ESD Co-Design For High-Speed SerDeS In FinFET Technologies
By Synopsys - 07 Jun, 2023 - Comments: 0

An electronic device is susceptible to Electrostatic Discharge (ESD) damage during its entire life cycle, including the phase from the completion of the silicon wafer processing to when the device (die) is assembled in the system. To avoid yield loss due to ESD damage during this early phase, on-chip ESD protection measures are applied to provide a certain degree of ESD robustness. The componen... » read more

Blog Review: June 7
By Jesse Allen - 07 Jun, 2023 - Comments: 0

Synopsys' Kenneth Larsen and Powerchip's S.Z. Chang explore wafer-on-wafer (WoW) and chip-on-wafer (CoW), 3D hybrid bonding schemes that can be used to stack memory on logic with shorter signal transmission distance at no wasted power and more interconnect and bandwidth density. In a podcast, Siemens' Conor Peick, Nand Kochhar, and Mark Sampson chat about how companies can address growing co... » read more

Journey From Cell-Aware To Device-Aware Testing Begins
By Laura Peters - 06 Jun, 2023 - Comments: 0

Early results of using device-aware testing on alternative memories show expanded test coverage, but this is just the start. Once the semiconductor industry realized that it was suffering from device failures even when test programs achieved 100% fault coverage, it went about addressing this disconnect between the way defects manifest themselves inside devices and the commonly used fault mod... » read more

The Ever-Increasing Role Of PVT Monitor IP And Its Significance In Silicon Lifecycle Management
By Rohan Bhatnagar - 05 Jun, 2023 - Comments: 0

The demand for semiconductor chips has grown exponentially over the years, driven by advancements in technologies such as artificial intelligence, the internet of things, 5G, automotive and cloud. With this increased demand, there is a growing need for more reliable semiconductor chips that can operate under extreme conditions and withstand the rigors of modern applications. Here are some of th... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 02 Jun, 2023 - Comments: 0

Japanese and American trade officials announced a joint roadmap for cooperation in strengthening global semiconductor supply chains by advancing Japan-U.S. collaboration with emerging and developing countries in the Indo-Pacific. China and South Korea agreed to strengthen dialogue and cooperation on semiconductor industry supply chains with a focus on the supply of key raw materials and ensu... » read more

Minimizing Cybersecurity Risks With ISO/SAE 21434
By Ron DiGiuseppe - 01 Jun, 2023 - Comments: 0

To mitigate the cybersecurity risk, industry stakeholders have developed the new ISO/SAE 21434 Road Vehicles—Cybersecurity Engineering standard. Industry leaders are quickly adopting ISO/SAE 21434 as the leading approach for cybersecurity. Suppliers such as Renesas announced1 their commitment to ISO/SAE 21434 in October 2021. Recently, NXP2 and Texas Instruments3 both certified their Au... » read more

Developing An Unbreakable Cybersecurity System
By John Koon - 01 Jun, 2023 - Comments: 0

Cyberattacks are increasing in frequency and sophistication, and the impact of those attacks is increasing almost exponentially as the amount and value of data continues to grow. Cybersecurity Ventures projected the annual cost of cybercrime will grow from $8 trillion in 2023 to $210.5 trillion by 2025, with no end in sight. On the target list are a slew of industrial and commercial segments... » read more

Security Becomes Much Bigger Issue For AI/ML Chips, Tools
By Lou Covey - 01 Jun, 2023 - Comments: 0

Security is becoming a bigger issue in AI and machine learning chips, in part because the chip industry is racing just to get new devices working, and in part because it's difficult to secure a new technology that is expected to adapt over time. And unlike in the past, when tools and methodologies were relatively fixed, nearly everything is in motion. Algorithms are being changed, EDA tools ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy