Self-Driving Architecture With eFPGAs

By Alok Sanghavi - 25 Feb, 2019 - Comments: 0

The favored self-driving architecture of the future will be increasingly decentralized. However, both the centralized and decentralized architectural design approaches will require hardware acceleration in the form of far more lookaside co-processing than is currently realized. Whether centralized or decentralized, the anticipated computing architectures for automated and autonomous driving ... » read more

Partitioning Drives Architectural Considerations

By Ann Mutschler - 25 Feb, 2019 - Comments: 0

Semiconductor Engineering sat down to explore partitioning with Raymond Nijssen, vice president of system engineering at Achronix; Andy Ladd, CEO at Baum; Dave Kelf, chief marketing officer at Breker; Rod Metcalfe, product management group director in the Digital & Signoff Group at Cadence; Mark Olen, product marketing group manager at Mentor, a Siemens Business; Tom Anderson, technical mar... » read more

Week In Review: Design, Low Power

By Susan Rambo - 15 Feb, 2019 - Comments: 0

Tools & IP Engineering simulation company ANSYS says thanks to new features in its ANSYS Twin Builder, product developers may be able save money in warranty and operational costs. The Twin Builder creates a digital twin of a systems in the field, enabling a convenient way to monitor and maintain systems remotely. The latest release adds predictive maintenance features for digital-twin runt... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 15 Feb, 2019 - Comments: 0

Internet of Things Is Google developing a Pixel Watch wearable? Perhaps, if recent job listings are any indication. The company recently was looking to hire someone as vice president of hardware engineering, wearables. Last month, Fossil Group sold smartwatch technology intellectual property to Google for $40 million, while Google hired certain members of Fossil’s wearables R&D team. ... » read more

Issues In Designing 5G Beamforming Antennas

By Kevin Fogarty - 07 Feb, 2019 - Comments: 3

As 5G networking inches closer to reality, one of the more stubborn problems also will be one of the smallest. Several issues have yet to be cracked with beamforming and massive MIMO antennas, which will make millimeter wave (mmWave) spectrum—a key ingredient in 5G networks—work on multiple devices and base-station locations. Millimeter wave is problematic yet promising. Between bands 30... » read more

Mine Cryptocurrencies Sooner, Faster, and Cheaper with Achronix Speedcore Embedded FPGAs

By Achronix - 06 Feb, 2019 - Comments: 0

New cryptocurrencies such as Monero introduce ASIC-resistance and memory-hardness to prevent ASICs from being built that give some operators a competitive mining advantage over others who do not have access to the same technology. This white paper discusses the relevant background and presents a solution based on Achronix Speedcore embedded FPGAs (eFPGAs), enabling users to regain a highly prof... » read more

Pushing AI Into The Mainstream

By Brian Bailey - 31 Jan, 2019 - Comments: 0

Artificial intelligence is emerging as the driving force behind many advancements in technology, even though the industry has merely scratched the surface of what may be possible. But how deeply AI penetrates different market segments and technologies, and how quickly it pushes into the mainstream, depend on a variety of issues that still must be resolved. In addition to a plethora of techni... » read more

IoT Merging Into Data-Driven Design

By Ed Sperling and Kevin Fogarty - 10 Jan, 2019 - Comments: 0

The Internet of Things is becoming more difficult to define and utilize for an effective business strategy. While an increasing number devices send data to the cloud or some local server, so much data is being generated and moved around that new strategies are being developed to rethink what needs to be processed where. Back in 2013, when the IoT concept really began taking off, connectivity... » read more

Speedchip FPGA Chiplets

By Achronix - 09 Jan, 2019 - Comments: 0

Next-generation SoC platforms are evolving rapidly to process and move enormous amounts of data from the edge; over the network and to the cloud for high data and compute intensive applications such as AI and machine learning, high-performance computing (HPC) and autonomous driving. As a result, next-generation ASICs need to be larger, faster and further optimized for performance, power and are... » read more

AI Market Ramps Everywhere

By Brian Bailey - 20 Dec, 2018 - Comments: 0

Artificial Intelligence (AI) has inspired the general populace, but its rapid rise over the past few years has given many people pause. From realistic concerns about robots taking over jobs to sci-fi scares about robots more intelligent than humans building ever smarter robots themselves, AI inspires plenty of angst. Within the technology industry, we have a better understanding about the pote... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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