tag: Advantest

Too Much Fab And Test Data, Low Utilization
By Anne Meixner - 12 Jan, 2021 - Comments: 7

Can there be such a thing as too much data in the semiconductor and electronics manufacturing process? The answer is, it depends. An estimated 80% or more of the data collected across the semiconductor supply chain is never looked at, from design to manufacturing and out into the field. While this may be surprising, there are some good reasons: Engineers only look at data necessary to s... » read more

Testing Silicon Photonics In Production
By Bryon Moyer - 12 Jan, 2021 - Comments: 1

As silicon photonics costs come down, the technology is being worked into new applications, from connectivity to AI. But full commercial production requires testing those photonic circuits before shipping them. Photonics testing is only getting started. Volume production is still not happening, and test equipment and techniques are still being developed. What exists today is a blend of exist... » read more

System-Level Test Methodologies Take Center Stage
By Fabio Pizza - 12 Jan, 2021 - Comments: 0

Because electronic systems for all applications in end-user markets must provide the highest possible reliability to match customers’ quality expectations, semiconductor components undergo multiple tests and stress steps to screen out defects that could arise during their lifecycle. Due to new semiconductor devices’ increasing design complexity and extreme process technology, increased test... » read more

Photonic Integration Based On A Ferroelectric Thin-Film Platform
By Advantest - 11 Jan, 2021 - Comments: 0

Photonic-integrated circuits (PICs) using ferroelectric materials are expected to be used in many applications because of its unique optical properties such as large electrooptic coefficients. In this study, a novel PIC based on a ferroelectric thin-film platform was designed and fabricated, where high-speed optical modulator, spot-size converters (SSCs), and a variable optical attenuator (VOA)... » read more

CEO Outlook: 2021
By Ed Sperling - 04 Jan, 2021 - Comments: 0

The new year will be one of significant transition and innovation for the chip industry, but there are so many new applications and market segments that broad generalizations are becoming less meaningful. Unlike in years past, where sales of computers or smart phones were a good indication of how the chip industry would fare, end markets have both multiplied and splintered, greatly increasin... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 Dec, 2020 - Comments: 0

Government and trade The U.S. Bureau of Industry and Security (BIS) has expanded its export control regulations for U.S.-based hi-tech companies. The BIS has added more companies to its “Military End User” (MEU) list. The list involves 103 entities, which includes 58 Chinese and 45 Russian companies. The U.S. government has determined that these companies are “military end users” or th... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Dec, 2020 - Comments: 0

Government policy--semiconductors Eighteen members of the European Union have launched an initiative to boost the EU’s efforts in processors and semiconductor technologies. The member nations will also work together to bolster leading-edge manufacturing capacity. The EU plans to invest up to $145 billion in the effort. “Europe has all it takes to diversify and reduce critical dependenci... » read more

Making Chips To Last Their Expected Lifetimes
By Ed Sperling - 21 Oct, 2020 - Comments: 2

Chips are supposed to last their lifetime, but that expectation varies greatly depending upon the end market, whether the device is used for safety- or mission-critical applications, and even whether it can be easily replaced or remotely fixed. It also depends on how those chips are used, whether they are an essential part of a complex system, and whether the cost of continual monitoring and... » read more

Chiplet Reliability Challenges Ahead
By Ed Sperling - 12 Aug, 2020 - Comments: 2

Assembling chips using LEGO-like hard IP is finally beginning to take root, more than two decades after it was first proposed, holding the promise of faster time to market with predictable results and higher yield. But as these systems of chips begin showing up in mission-critical and safety-critical applications, ensuring reliability is proving to be stubbornly difficult. The main driver fo... » read more

5G Brings New Testing Challenges
By Bryon Moyer - 11 Aug, 2020 - Comments: 0

As 5G nears commercial reality, makers of chips and systems that will support 5G will need to take on the standard burden of characterizing and testing their systems to ensure both performance and regulatory adherence. Millimeter-wave (mmWave) and beamforming capabilities present the biggest testing challenges. “5G is expected to have the extended coverage plus the bandwidth to harness ... » read more

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