tag: Advantest

AI/ML’s Role In Design And Test Expands
By Laura Peters - 06 Aug, 2024 - Comments: 1

The role of AI and ML in test keeps growing, providing significant time and money savings that often exceed initial expectations. But it doesn't work in all cases, sometimes even disrupting well-tested process flows with questionable return on investment. One of the big attractions of AI is its ability to apply analytics to large data sets that are otherwise limited by human capabilities. In... » read more

Leveraging AI To Efficiently Test AI Chips
By Ira Leventhal - 06 Aug, 2024 - Comments: 0

In the fast-paced world of technology, where innovation and efficiency are paramount, integrating artificial intelligence (AI) and machine learning (ML) into the semiconductor testing ecosystem has become of critical importance due to ongoing challenges with accuracy and reliability. AI and ML algorithms are used to identify patterns and anomalies that might not be discovered by human testers o... » read more

Chip Industry Week in Review
By The SE Staff - 02 Aug, 2024 - Comments: 0

Okinawa Institute of Science and Technology proposed a new EUV litho technology using only four reflective mirrors and a new method of illumination optics that it claims will use 1/10 the power and cost half as much as existing EUV technology from ASML. Applied Materials may not receive expected U.S. funding to build a $4 billion research facility in Sunnyvale, CA, due to internal government... » read more

Chip Industry Week In Review
By The SE Staff - 12 Jul, 2024 - Comments: 0

The U.S. Department of Commerce issued a notice of intent  to fund new R&D activities to establish and accelerate domestic advanced packaging capacity. CHIPS for America expects to award up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP), with about $150 million per award in each... » read more

Delivering On Power During HPC Test
By Anne Meixner - 09 Jul, 2024 - Comments: 0

The industry’s insatiable need for power in high-performance computing (HPC) is creating problems for test cells, which need to deliver very high currents at very consistent voltage levels through the power delivery network (PDN). In response, ATE, wafer probe, and contactor vendors are introducing some innovative approaches and test procedures that can ensure robust power delivery to ATE pro... » read more

X-ray Inspection Becoming Essential In Advanced Packaging
By Gregory Haley - 09 Jul, 2024 - Comments: 0

X-ray technology is moving into the mainstream of chip manufacturing as complex assemblies and advanced packaging make it increasingly difficult to ensure these devices will work as expected throughout their lifecycles. A single defect in a chiplet or interconnect can transform a complex advanced package into expensive scrap, and the risk only increases as the chip industry shifts from homog... » read more

Automotive Semiconductors Require Integrated Test Solution
By Toni Dircherl - 09 Jul, 2024 - Comments: 0

The automotive semiconductor test market is experiencing organic growth as chipmakers produce higher volumes of devices serving an array of automotive applications. In addition, the range of applications for automotive-grade semiconductors is evolving as the technology advances. Manufacturers of automated test equipment (ATE) are adapting to ensure their systems can handle devices ranging from ... » read more

What’s Missing In Test
By Anne Meixner - 19 Jun, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss how functional test content is brought up at first silicon, and the balance between ATE and system-level testing, with Klaus-Dieter Hilliges, V93000 platform extension manager at Advantest Europe; Robert Cavagnaro, fellow in the Design Engineering Group at Intel (responsible for manufacturing and test strategy of data center... » read more

Power-Aware Revolution In Automated Test For ICs
By Gregory Haley - 11 Jun, 2024 - Comments: 0

As semiconductor devices advance in complexity and sensitivity to power fluctuations, the integration of power-aware automatic test pattern generation (ATPG) is becoming indispensable for yield and the overall functionality of a chip. Unlike traditional ATPG, which generates test patterns solely to ensure device functionality, power-aware ATPG takes it a step further by meticulously consider... » read more

The Future Of Data Analytics And Semiconductor Testing
By Michael Chang - 11 Jun, 2024 - Comments: 0

The world is changing more rapidly than ever. With the explosion of Artificial Intelligence (AI), Machine Learning (ML) and data analytics, semiconductor manufacturers now have the opportunity to extract valuable insights from the massive amounts of data being generated throughout the silicon lifecycle. By leveraging AI algorithms and ML, semiconductor manufacturers can now optimize silicon des... » read more

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