tag: aging

Always-On, Ultra-Low-Power Design Gains Traction
By Ann Mutschler - 14 Apr, 2022 - Comments: 0

A surge of electronic devices powered by batteries, combined with ever-increasing demand for more features, intelligence, and performance, is putting a premium on chip designs that require much lower power. This is especially true for always-on circuits, which are being added into AR/VR, automotive applications with over-the-air updates, security cameras, drones, and robotics. Also known as ... » read more

Assuring Reliable Processor Performance At Scale
By Uzi Baruch - 08 Mar, 2022 - Comments: 0

In today’s data center environment, resilience is key. Cloud providers are built on as-a-service business models, where uptime is critical to ensure their customers’ business continuity. Reputation and competitiveness require service at extremely high performance, low power, and increasing functionality, with zero tolerance for unplanned downtime or errors. If you’re a hyperscaler, o... » read more

Preparing For 3D-ICs
By Ed Sperling - 16 Feb, 2022 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

Reliability Concerns Shift Left Into Chip Design
By Ann Mutschler - 22 Dec, 2021 - Comments: 1

Demand for lower defect rates and higher yields is increasing, in part because chips are now being used for safety- and mission-critical applications, and in part because it's a way of offsetting rising design and manufacturing costs. What's changed is the new emphasis on solving these problems in the initial design. In the past, defectivity and yield were considered problems for the fab. Re... » read more

Missing Interposer Abstractions And Standards
By Brian Bailey - 29 Nov, 2021 - Comments: 0

The design and analysis of an SoC based on an interposer is not for the faint of heart today, but the industry is aware of the challenges and is attempting to solve them. Until that happens, however, it will be a technique that only large companies can deploy because they need to treat everything almost as if it were a single die. The construction of large systems uses techniques, such as ab... » read more

Challenges In RF Design
By Roland Jancke - 14 Oct, 2021 - Comments: 0

Designing highly integrated components for radio frequency applications poses special challenges for system engineers, designers and the commissioning engineers. The boundary between chip, package and board is increasingly vanishing on modern components. It is growing more common for parts of the functionality to be moved to the package or even the board. In some cases, the requirements have be... » read more

Low-Power Always-On Circuits
By Ed Sperling - 27 Sep, 2021 - Comments: 0

Some circuits are always on. A smart phone wakes up when it senses a user, and a smart speaker responds to keywords. The challenge is to make sure these devices don’t consume a lot of power while the rest of a device is powered down, that it remains secure, and that it can quickly wake up whatever other functions are needed. All of this requires a significant amount of engineering work. Amol ... » read more

The Importance Of Aging Simulation In IC Design
By Andre Lange - 09 Sep, 2021 - Comments: 0

Electronics reliability has been an important quality criterion in the automotive sector and in industrial automation for years. Electronics in this sector have to achieve product lifetimes of 10+ years under partially harsh environmental conditions. But the reliability of electronics is also becoming more important in other fields. For example, end customers now keep consumer products longer, ... » read more

Sensor Fusion Everywhere
By Ed Sperling - 19 Jul, 2021 - Comments: 0

How do you distinguish between background noise and the sound of an intruder breaking glass? David Jones, head of marketing and business development for intuitive sensing solutions at Infineon, looks at what types of sensors are being developed, what happens when different sensors are combined, what those sensors are being used for today, and what they will be used for in the future. » read more

In-Chip Sensing And PVT Monitoring: Not Just An Insurance Policy
By Ramsay Allen - 11 May, 2021 - Comments: 0

You wouldn’t drive an expensive car without insurance or take a flight in an aircraft without performing instrument and control surface checks. So why would you take the risk of designing a multi-million dollar advanced node semiconductor device without making sure you are aware of, and able to manage, the dynamic conditions that had the potential to make or break a silicon product? Advanced... » read more

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