The Data Crisis Is Unfolding — Are We Ready?

By Alphawave Semi - 27 Mar, 2024 - Comments: 0

The rapid advancement of technology has led to an unprecedented amount of data being generated, captured, and consumed globally. However, this reliance on data comes at a considerable cost. The widespread sharing and processing of data is necessary to navigate our everyday lives. Still, any disruption to this process can have severe consequences, threatening our ability to function as a society... » read more

Designing AI Hardware To Deal With Increasingly Challenging Memory Wall (UC Berkeley)

By Technical Paper Link - 25 Mar, 2024 - Comments: 0

A new technical paper titled "AI and Memory Wall" was published by researchers at UC Berkeley, ICSI, and LBNL. Abstract "The availability of unprecedented unsupervised training data, along with neural scaling laws, has resulted in an unprecedented surge in model size and compute requirements for serving/training LLMs. However, the main performance bottleneck is increasingly shifting to memo... » read more

The Implications Of AI Everywhere: From Data Center To Edge

By Emma-Jane Crozier - 14 Mar, 2024 - Comments: 0

Generative AI has upped the ante on the transformative force of AI, driving profound implications across all aspects of our everyday lives. Over the past year, we have seen AI capabilities placed firmly in the hands of consumers. The recent news and product announcements emerging from MWC 2024 highlighted what we can expect to see from the next wave of generative AI applications. AI will be eve... » read more

AI/ML Challenges In Test and Metrology

By Gregory Haley - 12 Mar, 2024 - Comments: 0

The integration of artificial intelligence and machine learning (AI/ML) into semiconductor test and metrology is redefining the landscape for chip fabrication, which will be essential at advanced nodes and in increasingly dense advanced packages. Fabs today are inundated by vast amounts of data collected across multiple manufacturing processes, and AI/ML solutions are viewed as essential for... » read more

AI Performance And Real-Time Control In Robotics And Autonomous Applications

By Shingo Kojima - 07 Mar, 2024 - Comments: 0

Recent vision AI models have to deal with dynamic and complex environments, resulting in the need for more power efficiency and speed in real-time applications. To meet the market needs, Renesas released the next-generation Dynamically Reconfigurable Processor for AI (DRP-AI) accelerator. The DRP-AI accelerator delivers high-power efficiency of 10 TOPS/W, up to 10 times higher than the conve... » read more

HBM3E And GDDR6: Memory Solutions For AI

By Rambus - 06 Mar, 2024 - Comments: 0

AI/ML changes everything, impacting every industry and touching the lives of everyone. With AI training sets growing at a pace of 10X per year, memory bandwidth is a critical area of focus as we move into the next era of computing and enable this continued growth. AI training and inference have unique feature requirements that can be served by tailored memory solutions. Learn how HBM3E and G... » read more

Brain-Inspired, Silicon Optimized

By Barry Pangrle - 29 Feb, 2024 - Comments: 0

The 2024 International Solid State Circuits Conference was held this week in San Francisco. Submissions were up 40% and contributed to the quality of the papers accepted and the presentations given at the conference. The mood about the future of semiconductor technology was decidedly upbeat with predictions of a $1 trillion industry by 2030 and many expecting that the soaring demand for AI e... » read more

Thinking Big: From Chips To Systems

By Ed Sperling - 27 Feb, 2024 - Comments: 0

Semiconductor Engineering sat down with Aart de Geus, executive chair and founder of Synopsys, to talk about the shift from chips to systems, next-generation transistors, and what's required to build multi-die devices in the context of rapid change and other systems. SE: What are the biggest changes you're seeing in the chip industry these days, and why now? de Geus: It's not just the siz... » read more

Utilizing Artificial Intelligence For Efficient Semiconductor Manufacturing

By Vivek Jain - 22 Feb, 2024 - Comments: 0

The challenges before semiconductor fabs are expansive and evolving. As the size of chips shrinks from nanometers to eventually angstroms, the complexity of the manufacturing process increases in response. It can take hundreds of process steps and more than a month to process a single wafer. It can subsequently take more than another month to go through the assembly, testing, and packaging st... » read more

Tackling Variability With AI-based Process Control

By Anne Meixner - 22 Feb, 2024 - Comments: 0

Jon Herlocker, co-founder and CEO of Tignis, sat down with Semiconductor Engineering to talk about how AI in advanced process control reduces equipment variability and corrects for process drift. What follows are excerpts of that conversation. SE: How is AI being used in semiconductor manufacturing and what will the impact be? Herlocker: AI is going to create a completely different factor... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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