Machine Learning Invades IC Production


Semiconductor Engineering sat down to discuss artificial intelligence (AI), machine learning, and chip and photomask manufacturing technologies with Aki Fujimura, chief executive of D2S; Jerry Chen, business and ecosystem development manager at Nvidia; Noriaki Nakayamada, senior technologist at NuFlare; and Mikael Wahlsten, director and product area manager at Mycronic. What follows are excerpt... » read more

RISC-V: More Than a Core


The open-source RISC-V instruction set architecture (ISA) is attracting a lot of attention across the semiconductor industry, but its long-term success will depend on levels of cooperation never seen before in the semiconductor industry. The big question now is how committed the industry is to RISC-V's success. The real value that RISC-V brings is the promise of an ecosystem and the opportun... » read more

Adding AI To The IoT


The Internet of Things is about to undergo a radical change, fueled by vast number of things coupled with an almost pervasive presence of AI. The IoT today encompasses a long list of vertical markets, all of them connected to the Internet but not necessarily to each other. The concept of the IoT really began taking off in 2015, when a combination of data analytics, high-speed, affordable and... » read more

Week in Review: IoT, Security, Auto


Deals Dialog Semiconductor made a blockbuster deal with Apple – the chip company will license power management technologies and transfer some assets to Apple, which will use them in their internal chip research and development. More than 300 Dialog employees, mostly engineers, will join Apple, which will pay $300 million in cash for the transaction and prepay another $300 million for Dialog ... » read more

Making AI Run Faster


The semiconductor industry has woken up to the fact that heterogeneous computing is the way forward and that inferencing will require more than a GPU or a CPU. The numbers being bandied about by the 30 or so companies working on this problem are 100X improvements in performance. But how to get there isn't so simple. It requires four major changes, as well as some other architectural shifts. ... » read more

Reliability, Machine Learning And Advanced Packaging


Semiconductor Engineering sat down to discuss reliability, resilience, machine learning and advanced packaging with Rahul Goyal, vice president in the technology and manufacturing group at Intel; Rob Aitken, R&D fellow at Arm; John Lee, vice president and general manager of the semiconductor business unit at ANSYS; and Lluis Paris, director of IP portfolio marketing at TSMC. What follows ar... » read more

Using ASICs For AI Inferencing


Flex Logix’s Cheng Wang looks at why ASICs are the best way to improve performance and optimize power and area for inferencing, and how to add flexibility into those designs to deal with constantly changing algorithms and data sets. https://youtu.be/XMHr7sz9JWQ » read more

ADAS Meets Anthropology


Melissa Cefkin, principal scientist and design anthropologist at the Nissan Research Center, sat down with Semiconductor Engineering to talk about how people will interact with autonomous vehicles and AI and why different disciplines are required to make this work. What follows are excerpts of that conversation. SE: Why did Nissan hire an anthropologist? Cefkin: Anthropologists have been ... » read more

Thinking Ahead To Society 5.0


Industry 4.0 is a familiar term throughout the global semiconductor community. It conjures images of fully automated factories and computerized decision making at all levels of business. Less widely known is Japan’s thinking about the next step in technological evolution, which it calls Society 5.0. Instead of viewing upcoming technology advances as the fourth industrial revolution, Japan tak... » read more

The Next Big Chip Companies


Rambus’ Mike Noonen looks at why putting everything on a single die no longer works, what comes after Moore’s Law, and what the new business model looks like for chipmakers. https://youtu.be/X6Kca8Vm-wA » read more

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