Who will win in a world where architecture and packaging are now differentiators, and where intelligence, connectivity and security are the new prerequisites.
Rambus’ Mike Noonen looks at why putting everything on a single die no longer works, what comes after Moore’s Law, and what the new business model looks like for chipmakers.
Interest in the open-source ISA marks a significant shift among chipmakers, but it will require continued industry support to be successful.
Slowdown due to impact on timing, and dependencies between power, thermal and timing that may not be caught by signoff tools.
Access to source code makes it attractive for custom applications, but gaps remain in the tool flow and in software.
SoC bandwidth, integration expand as data centers use more FPGAs for machine learning.
Problems won’t derail next-gen litho, but could limit use and affect schedules.
AI-enabled systems are being designed to process more data locally as device scaling benefits decline.
Interest in the open-source ISA marks a significant shift among chipmakers, but it will require continued industry support to be successful.
Foundry forms ASIC subsidiary as it focuses on 14nm/12nm and above.
Market overcrowding, more efficient manufacturing, and growing list of scaling issues create a challenging competitive landscape.
Using the Von Neumann architecture for artificial intelligence applications is inefficient. What will replace it?
At least 5 technologies are in the running, with 3D XPoint leading the pack.
FD-SOI bonanza; KLA-Tencor’s tools; equipment forecast.
A primary goal of machine learning is to use machines to train other machines. But what happens if there’s malware or other flaws in the training data?
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