Who will win in a world where architecture and packaging are now differentiators, and where intelligence, connectivity and security are the new prerequisites.
Rambus’ Mike Noonen looks at why putting everything on a single die no longer works, what comes after Moore’s Law, and what the new business model looks like for chipmakers.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Increased transistor density and utilization are creating memory performance issues.
Lots of unknowns will persist for decades across multiple market segments.
FPGAs, CPUs, and equipment receive funding in China; 98 startups raise over $2 billion.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.
Some of the less common considerations for assessing the suitability of a system for high-performance workloads.
Manufacturing 3D structures will require atomic-level control of what’s removed and what stays on a wafer.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Disaggregation and the wind-down of Moore’s Law have changed everything.
OK, sure.
But, the time a wafer spends in the FAB has not changed. The nature of building a complex part is still limited by a system with a 5-10 month lead time from wafer start to finished product.
Come up with a way to JIT the inventory, and we can both get rich. That is the key to market risk and the reason not to have too many part numbers in fab at one time.