Benchmarks For The Edge


Geoff Tate, CEO of Flex Logix, talks about benchmarking in edge devices, particularly for convolutional neural networks. https://youtu.be/-beVEpKAM4M » read more

More 2.5D/3D, Fan-Out Packages Ahead


A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

Formal Signoff


Xiaolin Chen, senior AE at Synopsys, looks at what’s good enough coverage, what makes one assertion better than another, and where the potential holes are in verification. https://youtu.be/nBtKE0gDHBU » read more

Heterogeneous Computing Raises The Bar For Functional Verification


If there’s one thing certain in chip development, it’s that every innovation in architecture or semiconductor technology puts more pressure on the functional verification process. The increase in gate count for each new technology node stresses tool capacity. Every step up in complexity makes it harder to find deep, corner-case bugs. The dramatic growth in SoC designs brings software into p... » read more

Heterogeneous Computing Verification


Raik Brinkmann, CEO of OneSpin Solutions, looks at new architectures involving AI and machine learning, what changes in these multi-accelerator, multi-memories designs, and where problems can crop up both in design and verification. https://youtu.be/0Trtfq8_hKg       See other tech talk videos here. » read more

Building AI SoCs


Ron Lowman, strategic marketing manager at Synopsys, looks at where AI is being used and how to develop chips when the algorithms are in a state of almost constant change. That includes what moves to the edge versus the data center, how algorithms are being compressed, and what techniques are being used to speed up these chips and reduce power. https://youtu.be/d32jtdFwpcE    ... » read more

The Next Big Chip Companies


Rambus’ Mike Noonen looks at why putting everything on a single die no longer works, what comes after Moore’s Law, and what the new business model looks like for chipmakers. https://youtu.be/X6Kca8Vm-wA » read more

Tech Talk: Verification


Frank Schirrmeister, Cadence's senior group director for verification platforms, talks about what's changing in verification with 5G, machine learning, greater connectivity, advanced packaging, and the growing need to build security into designs. https://youtu.be/GMF8BkmdJzE » read more

The Great Machine Learning Race


Processor makers, tools vendors, and packaging houses are racing to position themselves for a role in machine learning, despite the fact that no one is quite sure which architecture is best for this technology or what ultimately will be successful. Rather than dampen investments, the uncertainty is fueling a frenzy. Money is pouring in from all sides. According to a new Moor Insights report,... » read more

Tuning Heterogeneous SoCs


It's one thing to pack multiple processor cores into a design, but it is much more difficult to ensure the hardware matches the software's requirements, or that the software optimally uses the hardware. Both the hardware and software teams are now facing these issues, and there are few tools to help them fully understand the problems or to provide solutions. Design teams continue to add more... » read more

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