Week in Review: IoT, Security, Auto


Internet of Things Amazon Web Services announced that Iridium Communications has joined the AWS Partner Network. AWS and Iridium have collaborated on development of Iridium CloudConnect, a service that enables worldwide coverage for Internet of Things applications through Iridium’s satellite network. AWS IoT is being paired with Iridium IoT services as a result. IHS Markit forecasts there wi... » read more

Making Buildings Smarter


Calling a building “smart” implies that technology is embedded to make that building more efficient, useful, convenient and profitable. The goal is to program efficiency beyond what humans can provide. But “smart” also may imply a healthy dose of marketing hype. No one wants to live in a “dumb building,” but it's difficult to define what makes a building smart. And while much is ... » read more

Cloud Drives Changes In Network Chip Architectures


Cloud data centers have changed the networking topology and how data moves throughout a large data center, prompting significant changes in the architecture of the chips used to route that data and raising a whole new set of design challenges. Cloud computing has emerged as the fast growing segment of the data center market. In fact, it is expected to grow three-fold in the next few years, a... » read more

Week in Review: IoT, Security, Auto


Internet of Things IBM this week launched the Watson Decision Platform for Agriculture, which combines artificial intelligence, Internet of Things technology, and cloud-based offerings, providing insights to farmers through a managed service. Among other features, growers can deploy drones to send photos to the IBM Cloud for AI-based trend analysis and detection of crop diseases. The platform ... » read more

What Will Intel Do Next?


The writing is on the wall for big processor makers. Apple, Amazon, Facebook and Google are developing their own processors. In addition, there are more than 30 startups developing various types of AI accelerators, as well as a field of embedded FPGA vendors, a couple of discrete FPGA makers, and a slew of soft processor cores. This certainly hasn't been lost on Intel. As the world's largest... » read more

AI Chips Must Get The Floating-Point Math Right


Most AI chips and hardware accelerators that power machine learning (ML) and deep learning (DL) applications include floating-point units (FPUs). Algorithms used in neural networks today are often based on operations that use multiplication and addition of floating-point values, which subsequently need to be scaled to different sizes and for different needs. Modern FPGAs such as Intel Arria-10 ... » read more

The Revenge Of The Digital Twins


How do we verify artificial intelligence? Even before “smart digital twins” get as advanced as shown in science fiction shows, making sure they are “on our side” and don’t “go rogue” will become a true verification problem. There are some immediate tasks the industry is working on—like functional safety and security—but new verification challenges loom on the horizon. As in pr... » read more

Betting Big On Discontinuity


Wally Rhines, president and CEO of Mentor, a Siemens Business, sat down with Semiconductor Engineering to talk about the booming chip industry, what's driving it, how long it will last and what changes are ahead in EDA and chip architectures. What follows are excerpts of that conversation. SE: The EDA and semiconductor industries are doing well right now. What's driving that growth? Rhine... » read more

Week In Review: Design, Low Power


Tools & IP Cadence unveiled deep neural-network accelerator (DNA) AI processor IP, Tensilica DNA 100, targeted at on-device neural network inference applications. The processor is scalable from 0.5 TMAC (Tera multiply-accumulate) to 12 TMACs, or 100s of TMACs with multiple processors stacked, and the company claims it delivers up to 4.7X better performance and up to 2.3X more performance p... » read more

Week in Review: IoT, Security, Auto


Internet of Things Release 3 is published by oneM2M, the worldwide Internet of Things interoperability standards initiative. The third set of specifications deals with 3GPP interworking, especially as it relates to cellular IoT connectivity, among other features. The release is said to enable seamless interworking with narrowband IoT and LTE-M connectivity through the 3GPP Service Capability E... » read more

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