AI Process Control Platform Enabling Next Generation Technology, Part 2

By Tignis - 18 Oct, 2023 - Comments: 0

As feature dimensions in semiconductors continue to shrink and worldwide demand continues to expand, semiconductor equipment manufacturers need innovative ways to compete and deliver. The Tignis PAICe Maker physics-driven AI computational modeling platform accelerates leading-edge semiconductor manufacturing—from equipment R&D to reliable high-yield chip fabrication capability. Tignis sup... » read more

Chip Industry Week In Review

By The SE Staff - 13 Oct, 2023 - Comments: 0

By Liz Allan, Jesse Allen, and Karen Heyman. Canon uncorked a nanoimprint lithography system, which the company said will be useful down to about the 5nm node. Unlike traditional lithography equipment, which projects a pattern onto a resist, nanoimprint directly transfers images onto substrates using a master stamp patterned by an e-beam system. The technology has a number of limitations and... » read more

Memory Technologies Key To Advancing AI Applications

By Tim Messegee - 12 Oct, 2023 - Comments: 0

Memory is an integral component in every computer system, from the smartphones in our pockets to the giant data centers powering the world’s leading-edge AI applications. As AI continues to rise in reach and complexity, the demand for more memory from data center to endpoints is reshaping the industry’s requirements and traditional approaches to memory architectures. According to OpenAI,... » read more

Issues In Calculating Glitch Power

By Ed Sperling - 11 Oct, 2023 - Comments: 0

The amount of power consumed by redundant non-functional toggles, or glitch power, can be as high as 35% of total power consumption in a design. What can be done about that? Godwin Maben, low-power architect and scientist at Synopsys, takes a deep dive into the causes of glitch, how it is affected by new process nodes and heterogeneous integration, and the impact of different workloads, higher ... » read more

AI Testing AI: The Future Of 6G Test

By Marcus daSilva - 10 Oct, 2023 - Comments: 0

The impending arrival of 6G technology promises to revolutionize the way we connect and communicate. With expected data rates of up to 100 times faster than 5G, 6G is poised to enable unprecedented applications, from augmented reality (AR) and virtual reality (VR) to real-time remote surgery and autonomous vehicles with ubiquitous connectivity. A significant facet of 6G's potential lies in the ... » read more

Delivering Real-Time Analytics To Semiconductor Test

By Eli Roth - 10 Oct, 2023 - Comments: 0

As defined by Moore’s Law, the semiconductor field has been growing at a steady pace since the 1960s. Concurrent with this progression, semiconductors are becoming more complex, densely integrated, and expensive to produce. While such advancements pose new challenges to semiconductor manufacturing, we can extend Moore’s Law well into the future by reimagining the way we approach the semicon... » read more

How Much AI Is Really Needed?

By John Koon - 05 Oct, 2023 - Comments: 0

Tensor Core GPUs have created a generative AI model gold rush. Whether it’s helping students with math homework, planning a vacation, or learning to prepare a six-course meal, generative AI is ready with answers. But that's only one aspect of AI, and not every application requires it. AI — now an all-inclusive term, referring to the process of using algorithms to learn, predict, and make... » read more

Software Stack For Edge AI Performance

By Suhas Mitra - 05 Oct, 2023 - Comments: 0

Developing an agile software stack is important for successful AI deployment on the edge. We regularly encounter new machine learning models created from multiple AI frameworks that leverage the latest primitives and state-of-the-art ML model topologies. This Cambrian explosion has resulted from a fertile open-source community that has embraced AI and is now fueling a wide proliferation of ML m... » read more

Application-Optimized Processors

By Ed Sperling - 29 Sep, 2023 - Comments: 0

Executing a neural network on top of an NPU requires an understanding of application requirements, such as latency and throughput, as well as the potential partitioning challenges. Sharad Chole, chief scientist and co-founder of Expedera, talks about fine-grained dependencies, why processing packets out of order can help optimize performance and power, and when to use voltage and frequency scal... » read more

Accelerating Analog Design Migration

By Yuval Shay - 28 Sep, 2023 - Comments: 0

Today’s electronic chips are commonly comprised of a mix of analog, RF, and digital components, with increasing functionalities, complexities, and numbers of transistors reaching the trillions. While the digital side of the house can take advantage of automated design implementation tools, the analog world has always been more about doing things manually and in a very “custom” way—which... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: AI