Need To Share Data Widens In IC Manufacturing

By Ed Sperling - 31 Aug, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss issues in smart manufacturing of chips, including data management and grounding, chiplets, and standards, with Mujtaba Hamid, general manager for product management for secure cloud environments at Microsoft; Vijaykishan Narayanan, vice president and general manager of India engineering and operations at proteanTecs; KT Moore,... » read more

An Open-Source Solution To Accelerate Autonomous Vehicle Validation And Verification Research

By Technical Paper Link - 28 Aug, 2023 - Comments: 0

A technical paper titled “PolyVerif: An Open-Source Environment for Autonomous Vehicle Validation and Verification Research Acceleration” was published by researchers at Florida Polytechnic University, Embry-Riddle Aeronautical University, Tallinn University of Technology, and Acclivis Technologies. Abstract: "Validation and Verification (V&V) of Artificial Intelligence (AI) based cyb... » read more

Week In Review: Design, Low Power

By Linda Christensen - 25 Aug, 2023 - Comments: 0

Arm filed its registration statement for a highly anticipated IPO. Chip industry heavyweights Apple, Samsung, NVIDIA, and Intel are all expected to invest. Find the SEC filing here. Taiwan’s National Science and Technology Council (NSTC) laid out a 10-year initiative to bolster its IC design market share to 40% worldwide by 2033, with the first year’s budget of US $376 million. The sh... » read more

Generative AI: Transforming Inference At The Edge

By Paul Karazuba - 24 Aug, 2023 - Comments: 0

The world is witnessing a revolutionary advancement in artificial intelligence with the emergence of generative AI. Generative AI generates text, images, or other media responding to prompts. We are in the early stages of this new technology; still, the depth and accuracy of its results are impressive, and its potential is mind-blowing. Generative AI uses transformers, a class of neural network... » read more

AI, Rising Chip Complexity Complicate Prototyping

By Karen Heyman - 24 Aug, 2023 - Comments: 0

Prototyping, an essential technology for designing complex chips in tight market windows, is becoming significantly more challenging for the growing number of designs that include AI/ML. Prototyping remains one of the foundational pillars of the whole shift left movement, allowing software to be developed and tested before actual silicon is available. That, in turn, enables multiple teams t... » read more

The Power Of Computational Software: From Revolutionizing Chips To Cancer Research

By Reela Samuel - 24 Aug, 2023 - Comments: 0

This post is an excerpt from the keynote presentation at CadenceLIVE India, given by Nimish Modi, senior vice president and general manager of Strategy and New Ventures at Cadence. The semiconductor industry has grown significantly lately but follows a cyclical pattern marked by fluctuations. Currently, we are witnessing a macro-level correction aimed at resolving inventory imbalances. N... » read more

Using Data More Effectively In Chip Manufacturing

By Ed Sperling - 23 Aug, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss smart manufacturing and how tools and AI can enable it for semiconductors, with Mujtaba Hamid, general manager for product management for secure cloud environments at Microsoft; Vijaykishan Narayanan, vice president and general manager of India engineering and operations at proteanTecs; KT Moore, vice president of corporate ma... » read more

AI Process Control Platform Enabling Next Generation Technology

By Tignis - 16 Aug, 2023 - Comments: 0

PAICe Monitor delivers AI and machine learning-enabled analytics for all stages of the semiconductor fabrication process lifecycle — from process development and ramp readiness, to high volume production. Leveraging Tignis’ Digital Twin Query Language, PAICe Monitor enables process engineers to transform in-product fault diagnoses into continuous real-time monitoring—greatly improving ... » read more

Neuromorphic Computing: Graphene-Based Memristors For Future AI Hardware From Fabrication To SNNs

By Technical Paper Link - 15 Aug, 2023 - Comments: 0

A technical paper titled “A Review of Graphene-Based Memristive Neuromorphic Devices and Circuits” was published by researchers at James Cook University (Australia) and York University (Canada). Abstract: "As data processing volume increases, the limitations of traditional computers and the need for more efficient computing methods become evident. Neuromorphic computing mimics the brain's... » read more

Week In Review: Manufacturing, Test

By Karen Heyman - 11 Aug, 2023 - Comments: 0

TSMC, Bosch, Infineon, and NXP will jointly invest in the European Semiconductor Manufacturing Co. (ESMC), in Dresden, Germany, to provide advanced semiconductor manufacturing services. ESMC marks a significant step toward construction of a 300mm fab, which is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22nm planar CMOS and 16/12nm finFET proce... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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